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xFusion Unveils Future-Ready Solutions at OCP 2026

From October 12 to 15, 2026, xFusion, a global player in computing infrastructure, participated in the Open Compute Project (OCP) Global Summit held at the San Jose McEnery Convention Center. With a dedicated booth (A33), the company showcased its latest advancements in AI computing infrastructure, including liquid-cooled rack-scale systems, Super-Node architecture, and next-generation high-voltage DC solutions. The summit featured a keynote from Arthur Wang, Director of Product Management at xFusion, addressing the pressing challenges of power and cooling that define modern AI data centers.

Cooling Solutions for the AI Revolution

The exponential growth of AI workloads is pushing data center power density to unprecedented levels. Individual chips now exhibit power consumption exceeding 3,000 watts, while rack-level densities are inching toward megawatt territory. In this evolving landscape, effective power supply and cooling are turning from supplementary services into crucial elements that dictate the scalability of AI infrastructure.

During the keynote titled "Next-Generation Power & Cooling Solutions," Wang introduced a new framework for evaluating data center value—WATT → FLOPS → TOKEN → AGENT → VALUE. This innovative perspective shifts the focus from merely counting delivered servers or installed cards to assessing how efficiently each watt of power translates into real business outcomes—ranging from computational prowess to AI tokens and autonomous agents that deliver measurable value.

“In the Agentic era, competitiveness hinges not on the number of chips owned but on the tangible business value extracted from every watt and joule of heat,” Wang emphasized.

The Triad of Infrastructure Challenges

To realize this ambitious vision, xFusion identifies three critical infrastructure challenges that must be addressed simultaneously:
1. Cooling: Traditional air cooling is being outstripped by increasing chip heat density, leading to a shift towards 100% direct liquid cooling (DLC) as the standard for AI infrastructures. xFusion's advanced cooling solutions, utilizing diamond-copper composite materials, offer cooling capacities exceeding 4,000 watts per chip. The FusionPod for AI V8, a modular liquid-cooled 42U rack, accommodates flexible installations, providing up to 155 kW of power without the need for secondary piping modifications.
2. Power: The conventional 54V DC distribution is reaching its limits at the megawatt level, resulting in significant efficiency losses. To combat this, xFusion is pioneering an 800V high-voltage direct current (HVDC) architecture that drastically lowers current and conduction losses. The company’s 800V HVDC Sidecar, a next-generation power supply prototype capable of configurations ranging from 300 kW to 1.2 MW, lays the groundwork for megawatt-level rack power solutions.
3. Interconnectivity: The limitations of electrical signal transmission at speeds beyond 224 Gbit/s have necessitated a transition to optical connections—particularly Co-Packaged Optics (CPO)—to achieve the bandwidth density essential for large AI clusters. The DaYu 2.0 Super Node from xFusion, an open, liquid-cooled system capable of providing up to 240 kW per rack and supporting 128 XPUs per cabinet, exemplifies this technology while ensuring compatibility with multi-vendor processors without being tethered to a single chip architecture.

These three shifts do not occur in isolation; together, they form the technical foundation for what xFusion terms computing power synergy—a systemic approach that optimizes energy flow from the power grid to the chip.

A Commitment to Open Standards

With membership spanning over 60 industry organizations worldwide and contributions to numerous industry standards, xFusion operates within an ecosystem of over 30,000 partners. As AI workloads scale from cloud to edge and power density trends toward megawatt class, xFusion is committed to advancing an open, efficient infrastructure that transforms every watt into tangible benefits.

About xFusion

xFusion is a global provider of IT infrastructure and services, delivering server, edge computing, and data center solutions tailored for enterprise, cloud, and AI workloads. To learn more, visit www.xfusion.com.