#USA #San Jose #AI Data Centers #OCP Global Summit #xFusion

xFusion Presents Innovative Infrastructure at OCP 2026

xFusion, a global leader in computing infrastructure, recently made waves at the Open Compute Project (OCP) Global Summit 2026 held from October 12-15 in San Jose, California. The company showcased its latest solutions specifically designed to address the unique challenges posed by AI-powered data centers. With a major emphasis on cooling, energy supply, and interconnection, xFusion aims to redefine what is possible in the realm of data processing.

Addressing the Energy Demands of AI

As the demand for Artificial Intelligence (AI) escalates, so does the need for robust infrastructure that can handle unprecedented power densities. Today, individual AI chips can consume over 3,000 watts, leading to power density at the rack level that is moving towards megawatts. In his keynote speech, Arthur Wang, xFusion's Director of Product Management, outlined the company's new framework for evaluating data center value — moving from mere watts to tangible business outcomes. This approach emphasizes efficiency in transforming every watt of electricity into measurable value, aligning energy usage with performance and profitability.

Innovations in Cooling Solutions

One of the standout features of xFusion's presentation was its innovative cooling solution designed specifically for AI workloads. Traditional air cooling methods are no longer sufficient as chip thermal density surpasses physical limits. To tackle this issue, xFusion advocates for 100% direct liquid cooling. Utilizing advanced cold plate technologies made from diamond and copper composites, xFusion achieves cooling capacities of over 4,000 watts per chip. Their modular 42U FusionPod for AI V8 rack, which supports up to 155 kW, was highlighted as a flexible solution suitable for both existing environments and new container deployments.

Next-Generation Energy Supply Architecture

In terms of energy supply, xFusion criticizes conventional 54-volt DC systems for their inefficiencies at megawatt scales. The company is pioneering an 800 V high-voltage direct current (HVDC) architecture that significantly reduces current intensity and line losses. The Sidecar HVDC system is a prototype designed for configurations spanning from 300 kW to 1.2 MW, which sets a new standard for rack power supply.

Advancing Interconnectivity Options

As electrical signaling approaches its physical limits beyond 224G, xFusion is leading the charge in optical interconnections, including co-packaged optics (CPO). Their Super Node DaYu 2.0 system, leveraging liquid cooling and capable of delivering up to 240 kW per rack, supports up to 128 XPUs per cabinet, ensuring compatibility with a range of processors from different manufacturers without locking into a single vendor's chips.

A Focus on Open Standards and Global Reach

Collaboration is at the heart of xFusion's mission. The company has partnered with over 60 organizations worldwide, contributing to more than 60 industry standards, thereby nurturing an ecosystem of over 30,000 partners. As AI workloads transition from cloud environments to edge computing, xFusion aims to maintain its leadership position by driving open and efficient infrastructures that turn every watt into real value.

Conclusion

In conclusion, xFusion's contributions at the OCP Global Summit 2026 highlight their commitment to innovative infrastructure solutions. By addressing the critical elements of cooling, power supply, and interconnection, xFusion is not only transforming AI data centers but also redefining operational efficiencies in the IT landscape. For more information on their pioneering solutions, visit xfusion.com.