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xFusion at OCP 2026: Pioneering AI Infrastructure

The Open Compute Project (OCP) Global Summit 2026 in San José, California, has become a key event demonstrating technological advancements geared towards the rapid growth in artificial intelligence. From October 12 to 15, xFusion, a global provider of computing infrastructure, made a significant impact by unveiling its latest AI-centric solutions. These revolutionary products address the critical challenges of cooling, power supply, and interconnectivity, which are reshaping the landscape of next-generation AI data centers.

The conference commenced with a key address from Arthur Wang, xFusion's Director of Product Management, titled "Next-Generation Power and Cooling Solutions." This talk introduced an innovative framework for evaluating data center performance, focusing on how effectively energy consumption translates into tangible business outcomes. Instead of merely counting shipped servers, the emphasis shifts towards measuring the effective conversion of energy watts into operational value—from raw computational power to AI tokens and autonomous agents.

The Growing Demands of AI Workloads

As AI workloads surge, the energy density within data centers has reached unprecedented levels. Individual chips are now approaching power consumption of 3000 watts and above, leading to power densities at the rack level climbing into the megawatt range. As such, the methods of cooling and providing energy—once considered secondary logistics—have emerged as major constraints on the scalability of AI infrastructure.

During his presentation, Wang emphasized the evolving landscape of competitiveness, stating, "In the age of AI agents, it's not about how many chips you have, but the real commercial value derived from every watt and joule of heat produced."

Three Converging Revolutions

To fully grasp this new paradigm, xFusion is tackling three intertwined infrastructure challenges: cooling, electrical power supply, and interconnectivity. The company showcased its approach to overcoming these hurdles:

Cooling Innovations

Facing thermal densities at the chip level that exceed air cooling capabilities, direct liquid cooling (DLC) is set as the standard for AI infrastructure. xFusion's advanced cold plate solutions, using diamond-copper composite materials, are capable of delivering over 4000 watts of cooling per chip, providing ample headroom for next-gen processors. The FusionPod for AI V8, a 42U modular rack cooled by liquid, supports up to 155 kW and can flexibly deploy in renovation and containerized environments.

Power Supply Developments

The traditional 54V direct current distribution faces significant efficiency losses when scaled to megawatt levels. As a solution, xFusion is working on a high-voltage direct current (HVDC) architecture of 800V which drastically reduces current and line losses. Their prototype HVDC Sidecar operates from 300 kW to 1.2 MW, laying the groundwork for megawatt-class power supplies at the rack level.

Advancements in Interconnectivity

As electrical signaling reaches physical limits beyond 224 Gbit/s, the transition to optical interconnections—especially co-packaged optics (CPO)—is necessary for sustained bandwidth density demanded by large-scale AI clusters. xFusion’s DaYu 2.0 supernode system, featuring an open architecture and liquid cooling, delivers up to 240 kW per rack with the capacity for 128 XPU per cabinet and 256 XPU over two cabinets. This design maximizes compatibility across diverse processor suppliers, thus avoiding single-supplier dependencies.

These innovations are interconnected; together, they form the foundation of what xFusion refers to as "computing-power synergy," a systematic approach that enhances energy flow from the network to the chip.

Commitment to Open Standards

xFusion has established itself as a leader in developing open standards in the industry, collaborating with over 60 organizations and contributing to more than 60 industrial standards. Their ecosystem spans over 30,000 partners worldwide. As AI workloads shift from the cloud to the edge and power densities creep into megawatt territory, xFusion is poised to continue innovating in open and efficient infrastructure that transforms each watt into tangible value.

About xFusion

xFusion is a global provider of computing infrastructure and services, offering servers, edge solutions, and data center capabilities designed for enterprise, cloud, and AI workloads. For more information, visit www.xfusion.com.