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Siemens Revolutionizes 3D IC Design with Innovative Software Solutions

In the rapidly evolving semiconductor industry, companies are continually challenged by the complexities surrounding Integrated Circuit (IC) design, particularly in 3D architectures. Siemens Digital Industries Software has taken a significant step forward by launching two groundbreaking solutions in its Electronic Design Automation (EDA) portfolio: the Innovator3D IC suite and Calibre 3DStress. These innovations are designed to empower semiconductor design teams to tackle the intricate challenges associated with 2.5D and 3D IC designs.

Innovator3D IC Suite: Streamlined Design and Management

The Innovator3D IC solution suite represents a significant advancement for IC designers. It allows for efficient authoring, simulation, and management of heterogeneously integrated 2.5D/3D IC designs. This suite combines a user-friendly interface that leverages artificial intelligence with extensive multitasking capabilities. It is capable of managing designs that include over five million pins, making it an ideal choice for high-performance applications.

Key Components of Innovator3D IC

1. Innovator3D IC Integrator: This component serves as a centralized hub for constructing digital twins using a unified data model for various stages like design planning, prototyping, and predictive analysis.
2. Innovator3D IC Layout: Focused on correct-by-construction implementation, this solution ensures that package interposers and substrates are designed accurately and efficiently.
3. Innovator3D IC Protocol Analyzer: This tool is essential for analyzing compliance at various levels, including chiplet-to-chiplet and die-to-die interactions.
4. Innovator3D IC Data Management Solution: It facilitates effective management of design work-in-progress and ensures that intellectual property is handled securely and efficiently.

This suite is not just about ease of use; its architecture has been meticulously designed to allow high levels of performance while minimizing risks associated with design failure. This reduction in risk is vital for accelerating market readiness and improving overall yield and reliability in IC production.

Calibre 3DStress: Precision Analysis Under Pressure

In conjunction with the Innovator3D IC, Siemens introduced Calibre 3DStress, a cutting-edge simulation tool utilizing advanced thermo-mechanical analysis. It helps engineers identify and address the electrical impacts of stress at the transistor level earlier in the design process. The challenge of ensuring designs remain compliant even after packaging has been a significant concern, and Calibre 3DStress is engineered precisely to combat this issue.

Features of Calibre 3DStress

• - Thermo-Mechanical Stress Analysis: This feature enables IC designers to assess the effects of thermal and mechanical stresses that occur during the packaging of 3D ICs.
• - Verification and Debugging Capabilities: This tool allows for transistor-level verification of designs, ensuring that neither the packaging processes nor the product functionalities compromise circuit performance.
• - Enhanced Design Reliability: By predicting potential failures before they occur, Calibre 3DStress optimizes designs for enhanced performance and durability.

Combining the functionalities of Innovator3D IC and Calibre 3DStress, Siemens assures its clients that they can significantly cut down on design complexities and enhance the reliability of their products while adhering to stringent market timelines.

Industry Feedback and Future Outlook

Companies leveraging Siemens technology have reported notable improvements. Bryan Black, CEO of Chipletz, highlighted that the Innovator3D IC suite plays a critical role in delivering their advanced platform solutions. STMicroelectronics has also reflected positively on how Calibre 3DStress has allowed them to improve reliability while shortening time-to-market significantly.

As the semiconductor landscape continues to evolve, Siemens stands at the forefront, offering innovative solutions that not only address immediate challenges but also set the stage for future developments in IC design. By continuously refining and expanding their offerings, Siemens Digital Industries Software is indeed accelerating the digital transformation of semiconductor technologies, turning ambitious ideas into reality and paving the way for sustainable advancements in the industry.

To explore more about Siemens’ comprehensive suite of solutions for 2.5D/3D IC architectures, visit their official website.