#Valens Semiconductor #Hod Hasharon #AI Applications #Connectivity Solutions

Valens Semiconductor Showcases High-Performance AI Connectivity at Embedded World 2025

Valens Semiconductor, a prominent name in high-performance connectivity, is set to make a significant impact at Embedded World 2025, scheduled for March 11-13. Visitors will have the opportunity to explore groundbreaking connectivity technologies essential for various artificial intelligence (AI) applications. Valens will highlight partnerships with multiple key players in the machine vision market, including Leopard Imaging, Acroname, Airy3D, and Teledyne e2v, among others, showcasing solutions powered by Valens' standard-compliant chipsets.

Innovative Standards at the Forefront

Two pivotal connectivity standards will be showcased at the Valens booth: MIPI A-PHY and HDBaseT USB3. MIPI A-PHY serves as a native extension of the commonly utilized CSI-2 interface, enabling robotics developers to separate processing from perception sensors. This separation enhances design flexibility, cost-efficiency, and performance — a game-changer for developing advanced robotics solutions. On the other hand, HDBaseT USB3 extends USB 3.2 technology, supporting camera vendors in extending their product lines for applications that require long link distances, a critical need in industrial environments.

Live Demonstrations

Demonstrations at Valens' booth will provide real-world insights into how their technology can transform industries reliant on advanced connectivity. Key displays will include:

• - The Ultimate Connectivity Infrastructure for NVIDIA: Showcasing AI platforms related to automated mobile robots (AMR), robotic arms, and more.
• - EMC Technology Shootout: Demonstrating the robustness of Valens chipsets that withstand 20 times more noise compared to a legacy competitor in a live EMC shootout.
• - Simplest Wiring Infrastructure: Featuring the native CSI-2 extension based on MIPI A-PHY, displaying high-speed and long-reach sensor connectivity.
• - Solving USB Challenges for Embedded Systems: Focused on USB 3 protocol extension and test automation, addressing common industry challenges.

Speaking Opportunities

Valens will also take advantage of two speaking opportunities during the event:
1. How Can Connectivity Innovations Transform the Industrial Market? – March 11 from 11:00 AM to 11:30 AM CET.
2. Addressing the Challenges in the Medical Industry's Transition to Disposable Endoscopes – March 11 from 3:00 PM to 3:30 PM CET.

Moti Strobach, VP of Business Development at Valens Semiconductor, expressed that the company's foray into machine vision is already reshaping market dynamics. He stated, “With two standard-compliant chipsets that offer transformative connectivity, our technology empowers our customers and partners to explore new applications.