#United States #Los Angeles #Legrand #SENKO #Infinium acclAIM

Legrand's Infinium acclAIM™ Platform Expands Interoperability

Legrand, a renowned leader in electrical and digital infrastructure, is setting the stage at OFC 2026 to unveil the latest advancements in interoperability with its Infinium acclAIM™ fiber solution. This innovative platform now seamlessly integrates with SENKO's SN®-footprint connectivity, elevating efficiency and sustainability in high-density data center environments.

Revolutionizing Backbone Connectivity

Traditionally, data centers rely on cassette-based systems, which can be cumbersome and space-consuming. The Infinium acclAIM platform disrupts this standard by introducing a direct mating breakout connection design. With this shift, deployments can now boast ultra-high density, accommodating up to 288 fibers within a single rack unit. This innovative architecture effectively doubles the fiber density compared to standard LC-based panels, ensuring that users do not have to compromise on optical performance thanks to advanced precision ceramic ferrule technology.

Enhanced Flexibility through Collaboration

The collaboration between Legrand and SENKO brings forward an adapter solution that allows integration between the acclAIM backbone connector and the SN-footprint interface at the front of the patch panel. This advancement offers customers unprecedented flexibility during deployment, maintaining the integrity and performance of the acclAIM system. By ensuring compatibility, organizations can design their infrastructures with the freedom to choose their optimal connectivity configurations.

Sustainability at the Forefront

Not just about performance, the acclAIM platform stands out for its contribution to a more sustainable future in data center design. By omitting unnecessary cassette layers, it simplifies installations and minimizes components required for fiber link construction. This streamlined approach translates to reduced material usage, less hardware consumption, and a decreased carbon footprint, which supports longer life cycles for infrastructure without compromising scalability.

Phil Ward, the Director of Strategic Marketing at SENKO, expressed enthusiasm for this partnership: "SENKO is delighted to collaborate with Legrand, a company leading the way in ceramic multi-fiber backbone connectivity with its acclAIM platform. By enabling interoperability with the SN footprint, we’re giving customers greater architectural flexibility while supporting high-density, low-loss fiber infrastructures. Just as important, by simplifying connectivity, we reduce unnecessary hardware layers and contribute to a more sustainable and future-ready data center environment."

Experience at OFC 2026

Attendees of the OFC 2026 conference can visit Legrand Booth #5409 and SENKO Booth #1139 to witness the groundbreaking capabilities of the acclAIM platform in real-time. Demonstrations will showcase how the backbone architecture integrates seamlessly with SN-footprint front connectivity, effortlessly blending density, performance, and sustainability in tomorrow's data networks.

As an entity committed to continual innovation, Legrand not only focuses on technological enhancements but also seeks to shape the standards for responsible growth across the industry. The company reported impressive sales of €9.5 billion in 2025, reflecting its dedication to meeting evolving market demands with sustainable solutions.

With over 500 patents and 1 billion connectors deployed worldwide, SENKO remains a key player in the passive fiber optic industry. Their ongoing commitment to advancing optical solutions positions both companies at the forefront of high-performance networking.

For more information on the Infinium acclAIM platform and its extended capabilities with SENKO, visit Legrand’s website or SENKO’s website.