SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026
SK hynix Inc., a leading global semiconductor supplier, has announced its participation in the upcoming GTC 2026 event, scheduled from March 16 to 19 in San Jose, California. This prominent gathering, hosted by NVIDIA, is renowned for bringing together industry leaders and developers to explore the latest advancements and trends in artificial intelligence (AI) and accelerated computing.
The theme for this year's exhibition is 'Spotlight on AI Memory,' where SK hynix will present a comprehensive range of innovative memory solutions designed specifically for AI applications. The company's participation in GTC 2026 underscores its commitment to enhancing performance and minimizing data bottlenecks within NVIDIA's AI infrastructure—an essential aspect as AI technology evolves.
Exhibition Overview
Attendees can expect an engaging exhibition space featuring three main zones: the NVIDIA Collaboration Zone, Product Portfolio Zone, and Event Zone. Each area is meticulously designed to provide visitors with a hands-on and interactive experience related to AI memory technology.
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NVIDIA Collaboration Zone: Located at the entrance, this zone is a focal point showcasing the collaboration between SK hynix and NVIDIA. Here, visitors will see physical models and hardware demonstrating memory configurations mounted on GPU-based AI accelerators. Products like HBM4, HBM3E, and SOCAMM2—tailored for NVIDIA platforms—will be prominently displayed. Notably, a state-of-the-art liquid-cooled eSSD, developed in partnership with NVIDIA, will also be featured alongside an NVIDIA DGX Spark desktop AI supercomputer powered by SK hynix's LPDDR5X memory.
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Product Portfolio Zone: This area will present a comprehensive lineup of SK hynix memory solutions engineered for AI. Attendees can explore products essential for AI infrastructure, including HBM4, HBM3E, high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and automotive solutions. Interactive kiosks will allow visitors to select products and view their features dynamically, enhancing understanding of the technology.
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Event Zone: This zone will facilitate a unique hands-on activity with the 'HBM 16-High Stacking Game'. Participants will virtually stack memory chips to grasp concepts like TSV (Through Silicon Via) and high-stack packaging technology, fostering a deeper appreciation for the production of high-performance AI semiconductors.
Future Collaborations and Discussions
In addition to its exhibition, SK hynix aims to explore global collaboration strategies with key industry players during GTC 2026. Executives including SK Chairman Chey Tae-won and CEO Kwak Noh-jung will engage in discussions with influential tech leaders to share insights about the evolution of AI and the necessary infrastructure changes to support its growth.
The company will also organize technical sessions to discuss the future of AI-driven manufacturing and the critical role memory technology plays in achieving exceptional AI performance. SK hynix's representatives emphasize that as AI technology progresses, memory will evolve from a mere component to a fundamental element influencing the architecture and overall performance of AI systems.
With an objective to reshape the future of AI alongside global partners, SK hynix is enthusiastic about applying its expertise across the AI landscape, from expansive data centers to on-device applications. As GTC 2026 approaches, the company anticipates fruitful interactions and partnerships that will advance the field of AI memory solutions and drive technological innovation.
For more information about SK hynix and its offerings, visit
www.skhynix.com.