#Japan #Packaging #Tokyo #Semiconductor #Seminar

Upcoming Seminar on Semiconductor Packaging Basics and Quality Management

📅 Date: November 5, 2026
🕥 Time: 10:30 AM - 4:00 PM (JST)
🖥️ Platform: Zoom (Materials included)

Overview

CMCre Research Co., Ltd., is excited to announce an inviting online seminar focusing on the essentials and quality management of semiconductor packaging, and its latest trends. Led by renowned expert Mr. Kazuo Ikegata, this event aims to provide a comprehensive understanding of the current state and future directions of semiconductor packaging technology.

Seminar Highlights

This seminar will cover various topics including:

• - Basic Functions of Packaging: Understand essential functions requested from packaging and the evolution of packaging technology.
• - Manufacturing Processes: Detailed examination of the manufacturing processes involved in packaging, including back-grinding, dicing, die bonding, and more.
• - Quality Management: Insight into quality control measures necessary for packaging.
• - Latest Trends: An exploration of recent advancements, including System in Package (SiP), Wafer Level Packaging (WLP), and Through Silicon Via (TSV) technologies.
• - Practical Q&A: An interactive session to address your queries and enhance the learning experience.

Benefits of Participation

Participants will gain valuable knowledge that can be applied in their current roles, especially in research and development, enhancing communication between professionals from different industries. Understanding the recent challenges in packaging technology will prove beneficial for future material and device development.

Audience

This seminar is designed for novice engineers in packaging technology, equipment manufacturers, materials manufacturers, and marketing professionals looking to deepen their understanding of semiconductor-related technologies.

Registration Information

• - General Admission: ¥55,000 (tax included)
• - Newsletter Subscribers: ¥49,500 (tax included)
• - Academic Price: ¥26,400 (tax included)

For registration and additional details, please visit CMCre Research Website.

Program

The seminar will feature a structured program, including:
1. Introduction to Semiconductor Packaging
- Functions and types of packaging
- Structural insights and bonding techniques
2. Assembly Process Characteristics
- Points of challenge and strategies in key assembly processes
3. Quality Control of Packages
4. Technological Trends and Challenges
- Electrical properties, WLP, FOWLP, SiP, TSV, and three-dimensional packaging
5. Summary

About the Speaker: Kazuo Ikegata

Mr. Kazuo Ikegata is a consultant and lecturer at Success International Co., Ltd, with a rich background in semiconductor package development at Sony Corporation. His extensive experience in both manufacturing and educational roles equips him to provide insightful guidance in this seminar.

This is a remarkable opportunity for anyone passionate about semiconductor technologies. We encourage you to join us and expand your professional horizon in this vital area of innovation!