#USA #Fremont #SkyWater Technology #YES RapidCure #Deca Technologies

YES RapidCure Chosen by SkyWater Technology for Advanced Packaging

In a significant step for semiconductor packaging technology, Yield Engineering Systems, Inc. (YES) has teamed up with SkyWater Technology to implement its groundbreaking RapidCure systems. SkyWater, known for its innovative semiconductor solutions, will utilize YES's RapidCure technology in their M-Series™ fan-out wafer level packaging (FOWLP) process, a collaborative effort with Deca Technologies.

What is YES RapidCure Technology?

YES RapidCure is a state-of-the-art processing tool that integrates direct thermal and UV exposure methods. This advanced system is specifically designed to accelerate the curing process of low-temperature polymer materials, which are vital in modern semiconductor applications. The combination of UV pre-treatment followed by precisely controlled thermal curing dramatically reduces the traditional cycle times required for these processes, making it a game-changer in semiconductor manufacturing.

Impact on the Semiconductor Industry

As the demand for smaller and more efficient semiconductor devices grows, so does the need for sophisticated packaging solutions. This technology addresses these challenges by utilizing new polymer materials that require lower curing temperatures, leading to significant energy savings and improved manufacturing efficiency. With the RapidCure system, SkyWater Technologies anticipates enhanced yields in their production processes while also enabling faster prototyping capabilities.

Benefits of the Partnership

According to Bassel Haddad, Senior Vice President and General Manager of Advanced Packaging at SkyWater, the integration of YES’s RapidCure technology will support efforts to revamp the semiconductor supply chain. He states, “This technology is critical for reducing curing times, enabling SkyWater to offer faster prototyping services and increased reliability for our advanced packaging solutions.”

Rezwan Lateef, President of YES, echoes this sentiment, expressing excitement over the collaboration, “We are thrilled to enable SkyWater’s production increase of their M-Series technology. RapidCure technology represents a significant enhancement to our materials engineering capabilities.”

Technology Advancements and Future Prospects

The capabilities of RapidCure are further underscored by Tim Olson, Founder and CEO of Deca, who claims it can cure standard polymer materials such as polyimides and PBO in under 20 minutes. This dramatic reduction from the typical six-hour cure time may revolutionize the industry, particularly as more manufacturers look to enhance their efficiency and output.

As the semiconductor landscape continues to evolve, partnerships like those between YES and SkyWater are crucial for driving innovation. With YES RapidCure technology, the future of semiconductor packaging appears brighter, paving the way for next-generation electronic devices that promise to enhance our technological capabilities.

About YES

Yield Engineering Systems, Inc., based in Fremont, California, leads in the development of differentiated materials and interface engineering technologies. Their client roster includes top-tier companies focused on next-generation technologies across various sectors, including advanced packaging for AI calculations and life sciences. As the demand for cutting-edge semiconductor solutions grows, YES stands poised to play a pivotal role in shaping the future of this industry.