#USA #Santa Clara #Arizona State University #LQDX #Semiconductor Packaging

LQDX and Arizona State University Join Forces for Semiconductor Innovation

In a significant move towards advancing semiconductor packaging technology, LQDX Inc. has formalized a collaboration agreement with Arizona State University (ASU). This partnership, which builds on preliminary work started in 2024, aims to develop state-of-the-art integrated circuit (IC) substrates as well as innovative Fan Out Wafer Level Packaging (FOWLP) solutions, leveraging LQDX's proprietary Liquid Metal Ink (LMI®) technology.

The partnership supports ASU's status as a leader in semiconductor packaging research and development, particularly with the launch of its new Advanced Packaging Piloting Facility (PPF) that was established through the CHIPS for America initiative. This facility allows researchers and industry stakeholders to experiment with new materials and advanced packaging techniques in a high-tech R&D environment.

LQDX is set to provide ASU with advanced chemistries and process intellectual property associated with its LMI technology, fostering a collaborative environment where sponsored students and industry partners can explore innovative semiconductor packaging solutions right within Arizona's burgeoning ecosystem for semiconductor manufacturing.

Simon McElrea, CEO of LQDX, expressed his enthusiasm about this collaboration: "ASU has emerged as a focal point for semiconductor and packaging innovation in the U.S. Coupled with recent significant investments in CHIPS and large-scale manufacturing initiatives by companies like TSMC and Amkor, we see ASU as an ideal partner to elevate our research collaboration to new heights. This agreement aims at delivering next-generation IC substrates and advanced semiconductor packaging solutions through our cutting-edge PVD-in-a-Bottle™ technology."

In response to this collaboration, Professor Hongbin Yu from ASU highlighted the importance of partnerships in advancing technology: "We are delighted to work with LQDX. Our vision is to enhance the development and scaling of advanced semiconductor technologies that not only benefit Arizona's economic landscape but also contribute to the national technological advancement. We wholeheartedly welcome LQDX into our ecosystem."

LQDX has established itself as a pioneer in creating advanced materials for artificial intelligence (AI) and high-performance computing applications, thus opening new avenues for semiconductor packaging. Originating as a collaboration with the Stanford Research Institute (SRI), LQDX, based in Silicon Valley, California, has crafted innovative chemistries and processes that aim to revolutionize chip interconnect architectures.

As the demand for processing power continues to surge due to advancements in AI and machine learning, the industry faces an urgent need for innovative semiconductor packaging techniques. Central to LQDX's offerings is LMIx® – an advanced liquid metal ink technology that enables circuit production up to 250 times denser than traditional printed circuit boards (PCBs). This dense circuit capability, previously achievable only with conventional silicon, is essential to meet the growing demands associated with signal density required by sophisticated chips and Chiplets.

Moreover, LMIx® serves as a scalable alternative to costly wafer processing methods that utilize physical vapor deposition (PVD) technology. Its straightforward PVD-in-a-Bottle™ solution seamlessly integrates into existing manufacturing infrastructures, thus streamlining processes for semiconductor companies eager to innovate without significant disruptions.

In conclusion, this partnership between LQDX and Arizona State University signifies a pivotal step towards the future of semiconductor packaging technology. As both institutions share a vision of driving innovation, the outcomes from their collaboration could lead to significant advancements that benefit not only local and national economies but also contribute to the global semiconductor landscape.