HIKMICRO Unveils SuperScene: The Future of Thermal Imaging Innovation

HIKMICRO Introduces Groundbreaking Algorithms for Thermal Imaging



In the realm of thermal imaging technology, HIKMICRO has just made a significant leap forward with the launch of two highly advanced algorithmic functions: SuperScene™ and SuperScene+™. These algorithms are designed to redefine the standards of safe, automated, and efficient inspection processes in various applications including residential, electrical, and industrial settings. With an emphasis on accessibility, these tools not only enhance the inspection experience but also empower beginners to achieve a level of professional accuracy.

What Are SuperScene™ and SuperScene+™?


SuperScene™ is a smart scene recognition algorithm utilizing deep learning techniques to streamline the inspection process, making thermal imaging quicker and easier. Meanwhile, SuperScene+™ focuses on automating risk detection for safe inspections of electrical panels and circuit boards. These innovations represent a significant step towards making thermal imaging solutions not only more intuitive but also more inclusive for all users.

The introduction of SuperScene™ follows HIKMICRO’s earlier innovation, SuperDetect™, which automatically identifies problematic water leaks through analysis of sound frequencies and intensities. Traditionally, interpreting audio feedback required skilled professionals; however, SuperDetect™ has brought that expertise within reach of everyday users.

Stefan Li, HIKMICRO's International General Manager, highlighted the transformative nature of these new algorithms, stating: "We are recognized for offering cost-effective, quality thermal imaging solutions to the public, but we are opening a truly transformational chapter even by our standards. These ultra-intelligent algorithms optimize detection like never before, bridging the gap between complexity and simplicity."

Enhanced Inspection Capabilities


The SuperScene™ algorithm is designed to aid in the swift identification of issues such as air leaks, heat loss, and moisture damage in residential settings. It employs a vast array of thermal images showcasing common problems such as insufficient insulation or hidden water leaks. This enables the software to rapidly pinpoint potential insulation flaws and suspicions of water leaks during infrared inspections, making it an essential tool for both novices and professionals in thermal imaging.

Currently, SuperScene™ is available in beta version, with ongoing improvements and updates from HIKMICRO's technical experts expected to augment its precision and efficiency significantly.

For seasoned professionals, HIKMICRO's pocket and handheld cameras (models B20S, B21LS, Pocket2, operating under firmware V5.5.82) now feature a new function called Pro Scene. This intuitive color algorithm collaborates with additional tools like hygrometers to analyze thermal images and associate alarms based on temperature and humidity data. This functionality allows for quick identification of potential insulation defects (highlighted by a blue alarm) or humidity-related issues (indicated by a green alarm), effectively enhancing inspection efficiency, accuracy, and image clarity.

Streamlining Electrical Inspections with SuperScene+™


On the other hand, SuperScene+™ facilitates the automated detection of hazards in electrical panels and ensures the safety of circuit boards. By simplifying workflow with integrated algorithms that identify temperature measurement targets in specific scenarios, it reduces technicians' operational complexities, leading to safer inspections and more reliable results.

During electrical panel inspections, image recognition and Delta T (ΔT) algorithms work together to accurately locate overloaded or degraded fuses, utilizing absolute temperature alarms and relative difference warnings. This approach allows for the detection of microtemperature variations, as little as 0.5°C, to alert users to potential risks before they escalate.

Additionally, SuperScene+™ incorporates preconfigured models and AI calibration for batch control of high-density boards, effectively reducing calibration time for new circuit boards from over 30 minutes to under 5 minutes.

This feature is integrated into HIKMICRO’s thermal cameras in the M and SP series (models M31, M60, SP40, SP40H, SP60, SP60H, operating with firmware V5.5.96). SuperScene+™ helps streamline panel inspections in two steps and evaluates circuit boards in just one click, combining color-coded alerts with instant diagnostics for improved precision and consistency.

The Future of Thermal Imaging


The unveiling of SuperScene™ and SuperScene+™ represents a monumental advancement in making thermal imaging more intuitive, intelligent, and user-friendly. Whether for home inspections, tracing water leaks, or safeguarding industrial systems, HIKMICRO’s AI-driven tools are set to transform the inspection landscape, ensuring smarter inspections, faster decision-making, and more reliable outcomes.

For more information, visit HIKMICRO.

Topics Consumer Technology)

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