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TeraSignal and Synopsys: Transforming Optical Connectivity at DesignCon 2025

At the forefront of intelligent interconnect technology, TeraSignal has made impressive strides in the realm of high-speed optical connectivity. During DesignCon 2025, held from January 28 to 30 in Santa Clara, California, the company demonstrated a successful interoperability between its innovative TSLink technology and Synopsys' 112G Ethernet PHY IP.

A New Era in Data Center Connectivity

TeraSignal's TSLink, an intelligent chip-to-module (C2M) interconnect system, is aimed at enhancing the performance and efficiency of high-performance AI applications and data center infrastructure. The successful demonstration emphasizes TeraSignal's commitment to creating low-power, low-latency connection technologies essential for modern computing needs.

Designed to optimize link settings and to provide real-time monitoring, TSLink serves as a plug-and-play solution that connects large application-specific integrated circuits (ASICs) to linear optics. This is a crucial feature for the increasing complexity of AI and machine learning environments.

As data centers evolve, so do the demands on their infrastructure. Neeraj Paliwal, Synopsys' senior vice president of IP product management, stated, "The rapidly evolving architectures of hyperscalers require optical interconnects to provide low power and high bandwidth to scale AI networks." This kind of rapid development is necessary as organizations embrace sophisticated AI technology that relies on robust data infrastructure.

Collaboration Sparks Innovation

The collaboration between TeraSignal and Synopsys reinforces the importance of integrating their respective technologies into modern design frameworks. By leveraging advanced link training, diagnostics, and proven technologies, data center architect teams are empowered to efficiently connect their ASICs to optical modules. This integration ensures maximum signal integrity under diverse operating conditions, which is a fundamental requirement for achieving high-speed data transmission.

Rajinder Cheema, Corporate Senior Vice President at Socionext Inc., noted that the synergy between TeraSignal's TSLink technology and Socionext's custom System on Chips (SoCs) results in significant performance benefits, including enhanced system efficiency and reduced power consumption.

Unprecedented Performance Enhancements

One of the cornerstone features of TSLink is its protocol-agnostic design, which negates the need for Digital Signal Processors (DSPs). This leads to a remarkable 50% reduction in power consumption while also minimizing latency— an essential consideration for compute-intensive applications.

Furthermore, TSLink's real-time diagnostics and advanced monitoring capabilities work in tandem to ensure signal integrity, ultimately delivering consistent high-speed data performance crucial for AI inference and machine learning processes.

The interoperability showcased at DesignCon 2025 is poised to redefine industry standards for intelligent interconnects, providing a robust framework for developers seeking to mitigate design risk while expanding connectivity options.

Looking Ahead

The achievements at DesignCon mark a significant milestone for TeraSignal and its mission to redefine connectivity in data centers and AI-oriented environments. Available later this year will be a wider array of TSLink reference designs, inclusive of the necessary firmware and the TS8401/02 Intelligent Re-Driver. These innovations promise to advance optical interconnect solutions, contributing significantly to the ongoing evolution of data centers.

By revolutionizing how interconnections are made within the data center landscape, TeraSignal continues to lead the way in facilitating the next generation of AI-driven applications. For more detailed insights into TeraSignal's groundbreaking technologies and products, visit terasignal.com.