#USA #San Jose #AI Infrastructure #Wiwynn #OCP Global Summit

Introduction

Wiwynn, a trailblazer in cloud IT infrastructure, made headlines during the OCP Global Summit 2025 by presenting its innovative double-wide rack architecture. In a world where AI's computational needs are skyrocketing, this new architecture is set to provide a game-changing approach to data center design and efficiency.

The Challenge of AI Demand

As Artificial Intelligence technology evolves, the demand for more powerful and larger AI chips has surged. Traditional rack designs are increasingly unable to meet the requirements of modern data-intensive applications, leading to higher power density and more complex cooling needs. Recognizing this industry shift, Wiwynn has engineered a solution that not only accommodates larger components but does so with enhanced efficiency in mind.

Key Features of the Double-Wide Rack

The double-wide rack architecture introduced by Wiwynn features several key innovations designed to tackle the present challenges in high-density computing:

1. Expanded Dimension

The double-wide rack doubles the width of standard racks, allowing for the placement of up to four large AI accelerators side by side. This configuration can support cutting-edge chips scaling to 9.5-reticle sizes with 12× HBM memory and substrates up to 120 × 150 mm. The new design aims to maintain onboard interconnect speed and signal integrity, while dramatically reducing cable clutter that often leads to signal degradation.

2. HVDC Power Supply

To address the significant increases in power demand, Wiwynn’s architecture utilizes a High Voltage Direct Current (HVDC) power supply. By converting AC power to ±400/800 VDC for distribution to IT racks, the system minimizes energy losses and enhances scalability, positioning itself as a robust solution for contemporary data center needs.

3. Advanced Liquid Cooling Solutions

Wiwynn integrates advanced liquid cooling systems to manage the thermal output of high-performance chips effectively. This includes custom-designed cold plates and in-row cooling distribution units (CDUs) capable of handling 4 kW thermal loads. These features are crucial for ensuring reliable operation of AI and High-Performance Computing (HPC) workloads, emphasizing sustainability and efficiency.

4. Optimized Mechanical Design

The mechanical aspect of the double-wide rack also contributes to its performance. A reinforced chassis design helps prevent sagging even under the weight of massive components, supporting high-speed signal integrity crucial for scaling AI applications.

Future-Proofing AI Infrastructure

William Lin, President and CEO of Wiwynn, emphasized the necessity for innovative thinking to keep up with AI demands. The new double-wide rack architecture not only serves present needs but is also engineered with an eye toward the future capabilities of AI technology. By marrying HVDC power systems with advanced liquid cooling, Wiwynn aims to establish an infrastructure that's both scalable and efficient, directly supporting the future of AI.

Conclusion

The unveiling of Wiwynn's double-wide rack architecture at the OCP Global Summit 2025 marks a pivotal moment in data center technology. With a focus on meeting the growing demands of AI through pioneering designs, Wiwynn is set to lead the charge in transforming data center infrastructures to support tomorrow's AI applications. Industry leaders and stakeholders are encouraged to engage with Wiwynn to explore how these innovations can be implemented in their own facilities, ensuring both efficiency and reliability in an ever-evolving technological landscape.

Join Wiwynn at Booth B13 during OCP 2025 to experience these innovations firsthand and participate in workshops for deeper insights into the future of AI infrastructure.