Synopsys and TSMC Join Forces for Next-Gen Design Solutions

Synopsys and TSMC Collaborate to Advance Chip Design Solutions

In an exciting development for the semiconductor industry, Synopsys, Inc. has announced a strategic collaboration with Taiwan Semiconductor Manufacturing Company (TSMC). This partnership aims to enhance design workflows for TSMC's advanced node technologies and to empower companies engaged in artificial intelligence (AI), high-speed data communications, and advanced computing. This collaboration is not just about improving performance; it’s a significant step towards addressing the complex demands of modern technology.

Accelerating Design with AI

One of the standout features of this collaboration is the introduction of an AI-assisted optimization workflow. This innovative approach is designed to shorten design cycle times on TSMC's compact universal photonic engine, also known as COUPE. Utilizing platforms such as Ansys optiSLang®, Ansys Zemax OpticStudio®, and Ansys Lumerical FDTD™, engineers can improve design quality while expediting their processes. This means that engineers can spend less time on complex tasks and more time on innovation and refinement.

The collaboration also brings forth certified tools such as Ansys HFSS-IC Pro™ that facilitate accurate electromagnetic extraction for system-on-chip designs developed under TSMC's latest process technologies, including N5 and N3P. These certifications ensure that clients can confidently embrace the latest advancements without fear of compatibility issues.

Advanced Multi-Physics and Thermal Analysis

Continuing its commitment to innovation, Synopsys and TSMC have developed a multiphysics analysis flow that expands capabilities for larger and more intricate designs. This includes hierarchical thermal-aware and voltage-aware timing analyses that leverage Ansys RedHawk-SC and the Synopsys 3DIC Compiler™. These advancements are significant, particularly as the complexity of designs increases, allowing engineers to handle thermal management effectively and accelerate the convergence of large 3DIC projects.

Notably, the Ansys software suite is redefining optical coupling systems within the TSMC-COUPE™ architecture. With the integration of AI-assisted optimization, engineers can customize components like grating couplers, utilizing the cutting-edge photonic inverse design techniques provided by Ansys Lumerical FDTD. This transformation fundamentally enhances the design process, fostering quicker iterations and improved product outcomes.

System Solutions for Power Integrity

As part of the collaboration, Ansys RedHawk-SC and Ansys Totem play crucial roles in ensuring power integrity in chips designed using TSMC's advanced process technologies, including N3C, N3P, N2P, and A16™. These solutions are essential for verifying that products not only function as intended but also meet baseline performance goals critical for today’s demanding applications.

Furthermore, the Ansys HFSS-IC Pro solution offers electromagnetic modeling for chips on TSMC’s leading-edge N5 and N3P processes, ensuring that products can cater to a broad array of applications, from AI acceleration to high-performance computing (HPC) and beyond. The collaboration reflects a commitment to empowering designers with the tools they need to succeed in an increasingly competitive landscape.

Commitment to Future Innovations

Looking ahead, Synopsys and TSMC are also working on developing design flows for TSMC's A14 process, with the initial photonic design kit release expected in late 2025. This ongoing partnership not only focuses on current technology but also anticipates future innovations that will drive the industry forward.

In summing up the collaboration, John Lee, Vice President at Synopsys, stated, "Our strong and continuous partnership with TSMC has been key in maintaining our technological edge and in delivering consistent value to our shared customers." Aveek Sarkar, Director at TSMC, echoed this sentiment by highlighting the significance of joint efforts that foster advancements in high-speed communication and energy-efficient AI systems, marking a robust promise for the future of semiconductor design.

In conclusion, the collaboration between Synopsys and TSMC stands as a testament to the power of partnership in pushing the boundaries of technology, ensuring that both companies remain at the forefront of innovation in the semiconductor industry.