Compal Unveils Cutting-Edge Liquid-Cooled AI Servers at Supercomputing 2025

Compal's Innovative Liquid-Cooled AI Servers at SC25

Compal Electronics recently showcased its latest advancements in artificial intelligence (AI) and high-performance computing (HPC) servers during the Supercomputing 2025 (SC25) event held from November 17 to 20. This year’s presentation highlighted the company’s commitment to sustainable computing by introducing powerful liquid-cooled server solutions including the SG720-2A and SG223-2A-I models.

Key Features of SG720-2A / OG720-2A

The SG720-2A, a high-performance AI server, is engineered to handle the demands of modern computing. It features a robust architecture powered by dual AMD EPYC™ processors, which can support up to eight AMD Instinct™ MI325X GPUs. This system allows for forward compatibility with the MI355X architecture, making it a future-proof choice for data centers. The addition of AMD Pensando™ Pollara 400 AI NICs enhances the server's capabilities for scale-out infrastructure.

Designed with high-density computing in mind, the SG720-2A boasts a compact chassis of 850 mm in depth and a modular, tool-less service design. This design supports seamless integration into both EIA 19-inch and Open Rack v3 21-inch environments, facilitating easy upgrades and maintenance.

One of the standout features of these servers is the hot-swappable PCIe slots, which enable rapid network module replacement without causing any downtime—maximizing both operational flexibility and system uptime. This capability is critical for businesses that rely on continuous operations.

Advanced Cooling Solutions

Compal has integrated the ZutaCore® HyperCool® 2-Phase Direct Liquid Cooling (DLC) solution into the SG720-2A. This advanced cooling technology ensures stable and reliable performance, even under high-density workloads. Testing has shown that this system achieves an impressive Power Usage Effectiveness (PUE) as low as 1.05, coupled with a Partial PUE (pPUE) around 1.01, surpassing energy efficiency levels of traditional single-phase liquid-cooling systems by over 5%.

Additionally, the SG720-2A’s ability to support both single-phase and two-phase liquid-cooling architectures provides data centers with increased deployment flexibility. This adaptability helps balance performance requirements with energy efficiency and sustainability—something more crucial than ever in today's computing environments.

Innovations in the SG223-2A-I

Alongside the SG720-2A, the SG223-2A-I model also drew attention. This 2U server supports dual AMD EPYC™ processors and accommodates up to eight PCIe GPU accelerators. What sets the SG223-2A-I apart is its immersion cooling design, utilizing a high-conductivity dielectric fluid that markedly improves heat transfer and efficiency. This method ensures the stability of GPUs even under the stress of heavy workloads, while significantly lowering energy consumption.

Its open GPU-compatible design allows for versatility, accommodating various high-performance accelerators suited for AI and HPC tasks. By adopting this approach, Compal is offering a sustainable, high-efficiency solution for next-generation data center cooling.

Collaboration with AMD

Compal has strengthened its collaboration with AMD, focusing on the development of next-generation servers based on the upcoming AMD EPYC™ CPUs, codenamed ‘Venice’. New server models are slated for launch in the following year, promising improved performance and energy efficiency tailored for AI and HPC applications.

Moreover, Compal is partnering with AMI to enhance its servers with intelligent management capabilities. These features enable seamless remote monitoring, automated maintenance, and dynamic resource orchestration, which are vital for efficiency and resiliency in high-density AI data centers.

During SC25, Compal and AMI jointly hosted a session titled "Revolutionizing AI at Scale" at booth #4232, where they explored optimized strategies for AI server architecture and intelligent data center management.

Commitment to Sustainable Computing

Alan Chang, Vice President of Compal's Infrastructure Systems Business Unit, emphasized that the rapid progression of AI and HPC is steering data centers toward architectures that prioritize liquid cooling and memory interconnect technologies. Compal’s ongoing innovations aim to shape the future of high-performance, energy-efficient, and intelligent data center infrastructures that facilitate sustainable computing globally.

About Compal Electronics

Founded in 1984, Compal Electronics has established itself as a leader in the notebook and smart device manufacturing industry. The company emphasizes brand value through collaboration across various sectors and has received numerous awards for its groundbreaking product designs. Noteworthy recognitions in 2025 include being named one of Taiwan's top manufacturers by CommonWealth Magazine and consistently ranking among the Forbes Global 2000 companies. In recent years, Compal has focused on expanding its portfolio to include cloud servers, auto electronics, and smart medical solutions, leveraging its integrated R&D and manufacturing expertise.

For more information, visit Compal Electronics.