#USA #San Jose #AirJetMini #FroreSystems #AIperformance

Frore Systems Unveils AirJet®Mini G2

Frore Systems has recently made headlines with the launch of their most advanced cooling chip to date, the AirJet®Mini G2. Displayed in various partner systems at CES, this chip is set to transform the performance and design of devices in the market, including Qualcomm's Snapdragon X2 Elite 2-in-1 notebooks and Mini PCs.

First introduced at COMPUTEX 2025, the AirJet®Mini G2 exemplifies the transition from innovative technology to practical application, demonstrating Frore's commitment to enhancing thermal management in AI devices. The chip has already won the CES Innovation Award for the third year in a row, highlighting the industry's recognition of the importance of effective cooling solutions in supporting next-generation AI technologies.

Enhanced Thermal Management Capabilities

The AirJet®Mini G2 is not just another cooling solution; it builds upon a foundation of successful AirJet Mini designs already being utilized in the field. A prime example is ATT's Sonim MegaConnect™, the first ultra-compact Power Class 1 5G mobile hotspot, which takes advantage of the AirJet technology to achieve higher transmission powers in a compact, ruggedized design. By eliminating bulky heat management systems, this innovation is vital for mission-critical applications where performance and reliability are paramount.

Meeting the Demands of Evolving AI Workloads

As AI technology progresses from basic inference to complex reasoning models, there is an increased demand for sustained computing power. These models require prolonged processing time, leading to higher thermal output. The AirJet®Mini G2 addresses these challenges by enhancing heat removal efficiency by 50% compared to its predecessor, all while maintaining its ultra-compact form factor. This improvement allows processors to operate at elevated performance levels without overheating.

Silent Operation for Ultra-Compact Devices

In compact edge computing devices, thermal constraints often outstrip computational potential, making traditional cooling methods inadequate. The AirJet®Mini G2, measuring only 2.65 mm in thickness, provides an innovative solution by utilizing solid-state technology with no moving parts. This design not only ensures longevity but also enables devices to maintain peak performance without the constraints of noise or bulkiness.

During CES, Frore Systems has been showcasing the AirJet®Mini G2 in action within various applications:

• - A Qualcomm 2-in-1 notebook reference design that delivers silent, high-performance in a sleek package.
• - Qualcomm Mini-PC reference designs that realize sustained desktop-class performance in ultra-compact sizes.

This technology allows devices to perform for extended periods without throttling, even after prolonged use.

Technical Features of AirJet®Mini G2

The AirJet®Mini G2 boasts impressive technical specifications:

• - Heat Dissipation: 7.5W, representing a 50% increase over the previous model.
• - Dimensions: 27mm x 41.5mm x 2.65mm, making it suitable for ultra-compact designs.
• - Back Pressure: 1,750 Pa, providing superior dust and water resistance.
• - Noise Level: Only 21 dBA, allowing for silent operation.
• - Durability: Solid-state design ensures a long operational life without moving mechanical components.

By producing high-velocity air jets, the AirJet®Mini G2 efficiently exhausts heat from compact enclosures. Its small footprint can be integrated into a variety of devices, from notebooks and tablets to smartphones and IoT hardware, thereby enhancing performance across multiple industries including datacenter, defense, and automotive.

Recognition and Future Outlook

The recognition garnered from multiple CES Innovation Awards underscores the growing acknowledgment that effective thermal management is a critical enabler for edge AI systems rather than a secondary concern.

“AI reasoning models necessitate uninterrupted performance rather than brief surges,” says Seshu Madhavapeddy, CEO of Frore Systems. “The AirJet®Mini G2 effectively dismantles the thermal obstacles that have historically hindered ultra-compact devices, enabling products such as ultra-thin 2-in-1 notebooks and Mini-PCs to perform longer and quieter.”

Frore Systems will continue its demonstration of the AirJet technology at CES 2026, highlighting applications within industrial and consumer products, alongside showcasing its innovations like LiquidJet for larger scale cooling solutions.

Explore the future of AI performance at Frore Systems’ booth from January 6–9 at the Venetian Expo in Las Vegas, where attendees can experience these groundbreaking technologies firsthand.