#USA #Milpitas #Socionext #SoC Design #high-bandwidth

New White Paper on High-Bandwidth Switch Fabric SoC

On July 9, 2025, Socionext America Inc. unveiled a compelling white paper titled "Optimizing High-Bandwidth Switch Fabric SoC Design Minimizing Implementation Risks, Ensuring First-Pass Success, and Accelerating Time-to-Market." This insightful document arrives as the demand for data centers continues to magnify in the wake of high-bandwidth streaming, 5G wireless technology, and IoT connectivity—each creating new challenges for switch fabric System-on-a-Chip (SoC) designs.

The Crucial Role of Switch Fabric SoCs

As the complexity of data routing within modern data centers escalates, the role of high-bandwidth switch fabric SoCs becomes increasingly critical. The white paper delves into various architectural elements of these SoCs, emphasizing high-speed input/output (I/O), internal fabric interconnects, and sophisticated traffic management logic. Collectively, these components are engineered to support incredible bandwidths up to 102.4 terabits per second, a feat that underscores the technological evolution in data centers.

Key Insights from the White Paper

The white paper offers a comprehensive investigation into several pressing technical aspects:
1. Signal Integrity: It discusses the challenges presented by high-speed SerDes (Serializer/Deserializer) interfaces. Key factors such as impedance control, insertion loss, and methods for mitigating crosstalk across thousands of differential signals are explored.
2. Power Integrity Assessment: This section of the paper evaluates power delivery networks, illustrating how they affect SerDes performance and emphasizing the importance of managing power supply noise across the die, package, and PCB.
3. Design Flow Innovation: The article proposes a simulation-driven design methodology that facilitates early-stage simulations of SoC floorplans, package designs, and data transmission channels. This approach accelerates iterations and optimizes system performance even before moving into physical design.
4. Thermal Management: The integration of FloTHERM thermal analysis is crucial for ensuring that junction temperatures remain compliant, thereby enhancing the overall reliability of the system.

Navigating the Challenges of Bandwidth Design

Designing SoCs that reach these high bandwidths entails significant challenges that engineers must navigate. The white paper presents a practically oriented design flow aimed at minimizing risks and augmenting the likelihood of first-pass silicon success. By adopting simulation-driven methodologies, engineering teams can expedite their projects’ time-to-market without compromising quality.

Download and Explore

For individuals or organizations looking to get detailed insights into the design methodologies of high-bandwidth switch fabric SoCs, the white paper can be accessed at Socionext's official site.

Moreover, further inquiries or requests for briefings with Socionext's SoC design experts can be sent to [email protected].

About Socionext America Inc.

Headquartered in Milpitas, California, Socionext America Inc. operates as the U.S. arm of Socionext Inc., a renowned global provider of advanced System-on-Chip technologies. The company is dedicated to pushing boundaries in semiconductor innovation, offering customizable solutions to meet evolving industry needs. Socionext maintains collaborative partnerships across the manufacturing spectrum, including intellectual property, electronic design automation (EDA), and software, ensuring high-quality product offerings.

For more details, prospective clients can reach out via email or phone, or connect on their social media platforms including LinkedIn and YouTube.