Longsys to Present AI-Optimized Storage Solutions at Electronica 2026
The highly anticipated Electronica 2026 event is set to take place from November 10-13 in Munich, Germany. This year, Longsys, a leader in semiconductor storage solutions, is gearing up to showcase their groundbreaking products and technologies designed to empower edge AI applications. The theme for this presentation focuses on "Integrated Storage for Edge AI Applications."
As artificial intelligence (AI) technology transitions from the cloud to edge devices, the demand for innovative storage solutions arises. Automotive and industrial applications necessitate storage systems capable of delivering high bandwidth, remarkable endurance, and reliable operation across a wide range of temperatures in challenging environments. In these contexts, storage evolves from being a mere data repository to a crucial cornerstone that supports robust, real-time AI inference and perception tasks.
At Electronica, Longsys will unveil its first industrial-grade mSSD, engineered to function effectively under extreme temperature variations. This product employs System-in-Package (SiP) technology, which consolidates the controller, flash memory, and passive components into a singular package. This design not only streamlines the assembly process by eliminating the need for surface mount technology (SMT) but also reduces material consumption and production demands. The infusion of resilience is achieved through a construction designed to withstand environmental stressors such as water, dust, and shock, ensuring industrial-grade reliability and a broad operational temperature range. Moreover, Longsys' commitment to eco-friendly manufacturing processes positions its products toward sustainable industrial applications.
Among other exciting innovations, Longsys will present a comprehensive suite of automotive and industrial-grade storage solutions, including UFS, eMMC, LPDDR, and SPI NAND Flash. The renowned consumer storage brand, Lexar, will introduce USB drives and high-performance industrial-grade SD and microSD cards, catering to applications involving intelligent cockpits, Advanced Driver Assistance Systems (ADAS), industrial controls, and transportation networks.
The event will also feature live demonstrations of AISSD, AIDIMM, and HLCache UFS, showcasing innovative storage solutions tailored to optimize data access speeds, model loading times, and cache acceleration for devices supporting integrated AI functionalities. Such developments aim to simplify system designs, enhance inference responsiveness, and fortify overall system stability.
From industrial innovation to a comprehensive lineup of automotive and industrial storage solutions, Longsys is committed to advancing integrated storage technologies in the era of AI. Attendees are encouraged to visit Longsys at booth C2.459 within Hall C2 at Messe München to explore what the future holds for edge AI storage solutions. The organization looks forward to engaging with industry partners in Munich!
About Longsys
Founded in 1999, Longsys (301308.SZ/09976.HK) is recognized as a global leader in branded semiconductor storage solutions, specializing in research and development, design, packaging, testing, manufacturing, and sales services. For further information, please visit
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