#Taiwan #Hsinchu #InPsytech #UCIE 2.0 #SoIC Design

InPsytech's Latest Advance in Semiconductor Technology

InPsytech, a prominent name in the high-speed semiconductor IP solutions market and a key player within the Egis Group, recently announced a major milestone. The company has successfully taped out its next-generation design for TSMC's Face-to-Face (F2F) System on Integrated Chips (SoIC), which is fully compliant with the Universal Chiplet Interconnect Express (UCIE) 2.0 standard. This groundbreaking achievement aids in facilitating swift interconnects crucial for the advancement of heterogeneous chiplet integration.

This innovative design capitalizes on Through-Silicon Via (TSV) technology, which significantly optimizes signal transmission and power delivery between chips. This enhancement not only boosts the design flexibility but also increases the integration efficiency of 3D stacked heterogeneous chips, paving the way for more sophisticated semiconductor solutions.

To further support its clientele, InPsytech has simultaneously introduced extensive wafer-level and package-level design verification solutions customized for TSMC's advanced SoIC processes. This streamlined approach aims to speed up the development and validation process for integrated circuit (IC) designs, allowing customers to reduce their time to market dramatically.

InPsytech’s commitment to innovation is underscored by its recent participation in the Intel Foundry Accelerator IP Alliance and its involvement in Samsung's SAFE™ (Samsung Advanced Foundry Ecosystem) program. As a newly established IP partner of both Intel and Samsung, InPsytech is integrating its advanced solutions into leading foundry ecosystems, enabling their customers to elevate the competitiveness of their upcoming semiconductor products. The capabilities of this 3D heterogeneous integration and high-speed interconnect architecture are incredibly beneficial for high-performance computing servers and edge AI devices. They facilitate more efficient AI inference and data processing with enhanced speeds and lower latency.

Howard Ro, General Manager of InPsytech, stated, “InPsytech has always been driven by technology, and we are proud to collaborate with industry partners in pursuit of innovation. The successful completion of this design project is a testament to the dedication of our team and the support of our partners in the semiconductor industry. It also reflects the strong confidence our customers have in our technical capabilities.”

Looking ahead, InPsytech aims to sustain its focus on innovation and technical excellence. By bolstering collaborations with both local and global teams, the company seeks to serve its international clients better and contribute to the establishment of a more advanced and intelligent technological ecosystem. This focus on continuous advancement maintains InPsytech's status as a leader in the semiconductor IP landscape and positions it well for future successes.

With its recent achievements, InPsytech not only solidifies its place in the semiconductor industry but also reshapes the way technology is perceived and utilized in modern applications. The integration of advanced technologies like F2F SoIC under UCIE 2.0 exemplifies a promising future for various sectors, especially in high-performance computing and artificial intelligence domains. Through continued innovation, InPsytech is not just keeping pace with industry advancements but is leading the charge toward a more connected and efficient technological future.