#Laser Technology #Malaysia #Kuala Lumpur #ER Engineering #Plasma Solutions

ER Engineering Showcases Cutting-Edge Technology at SEMICON SEA 2026

Next week, ER Engineering (8027.TW) will take center stage at the SEMICON Southeast Asia 2026, where it will unveil its innovative laser and plasma solutions aimed at meeting the critical demands of AI, advanced packaging, and next-generation manufacturing processes. The company collaborates closely with Horng Terng Automation (HTA) and Group Up Industrial (GP) to provide fully integrated and turnkey solutions to their clients.

As the tech industry rapidly evolves, the urgency of high-precision manufacturing has never been more pronounced. ER Engineering’s participation in this event is not only about showcasing their latest advancements but also about demonstrating how their technologies are setting a new standard in the semiconductor industry.

Technology Highlights

ER's technology lineup for 2026 highlights advanced laser and plasma techniques that include:

• - High-Precision Laser Drilling for 2.5D/3D ICs, achieving an impressive ±5 μm accuracy with a B/T ratio of up to 90%.
• - Multibeam Laser Marking which boasts ±25 μm accuracy and provides high throughput solutions.
• - Controlled Thermal Laser Cutting, enhancing precision in material shaping and modification.
• - Microwave or RF Plasma Cleaning essential for surface activation and readiness before material filling processes.
• - Hybrid Plasma Solutions designed for highly efficient dry etching processes.

ER Engineering also offers an Automation Integration Service (AIS) that leverages over 30 years of expertise in delivering tailored automation solutions. This service integrates various process modules from different suppliers into a unified, highly efficient system using simulation-based modeling. It results in a streamlined user interface and a single service window for customer support.

Advanced Solutions for FOPLP Packaging

ER's comprehensive solution supports large panel processes, which include laser marking, laser cutting, plasma cleaning, and post-drilling deburring, all with exceptional warping control of up to 16 mm. The process is uniquely enhanced by utilizing laser debonding and plasma dry etching techniques to effectively separate glass substrates from the main panel, ensuring superior quality and efficiency.

Attendees at SEMICON SEA can visit ER Engineering at Booth #1452, located in the Malaysia International Trade and Exhibition Centre (MITEC), from May 5 to May 7, 2026. This is a prime opportunity to learn firsthand how ER, HTA, and GP are driving forward the future of semiconductor manufacturing with superior, integrated solutions that promise greater precision and efficiency.

For more information, you can visit ER’s official website at https://en.enr.com.tw/ to explore the latest updates and technologies being showcased.

Don’t miss the chance to experience the forefront of technological innovation at SEMICON SEA 2026, where ER Engineering will set the standard for what's possible in the semiconductors of tomorrow.