#Malaysia #Kuala Lumpur #ER Engineering #SEMICON SEA #Plasma Technology

Leading the Future of Semiconductor Manufacturing

ER Engineering, listed under 8027.TW, is set to showcase its advanced laser and plasma solutions at the upcoming SEMICON Southeast Asia 2026, scheduled from May 5 to May 7 at MITEC in Malaysia. The event marks a significant opportunity for ER to highlight its innovations tailored for AI applications, advanced electronic component production, and the next generation of manufacturing techniques.

Collaboration for Enhanced Solutions

At SEMICON SEA 2026, ER Engineering is partnering with Horng Terng Automation (HTA) and Group Up Industrial (GP). This collaboration aims to provide a fully integrated and turnkey solution tailored to the self-sufficient production of semiconductor technology. The combined expertise of these companies focuses on providing precision solutions and seamless automation processes that enhance product reliability and efficiency.

Key Features of ER Engineering’s Offerings

The highlight of ER Engineering's presentation will focus on its cutting-edge technologies in laser and plasma processing:

• - Advanced Plasma and Laser Packaging: The solutions involve precise laser drilling, interconnecting circuits in 2.5D/3D formats with accuracy levels reaching ± 5 μm.
• - High-Speed Laser Marking: Multi-beam laser marking technologies ensuring high throughput with a precision of ± 25 μm, enhancing productivity.
• - Controlled Thermal Laser Cutting: Ensuring efficient cutting processes crucial for the semiconductor industry.
• - Microwave and RF Plasma Cleaning: Utilized for pre-filling, surface activation, and ensuring optimal surface preparation, which is critical in component assembly.
• - Hybrid Plasma Solution: Offering high-efficiency dry etching solutions that meet the rising demands of microelectronics fabrication.

In addition to technology innovation, ER Engineering is also emphasizing its Automation Integration Service (AIS), leveraging over 30 years of experience to tailor automated manufacturing systems. This service integrates process modules from different vendors into a unified and efficient system based on simulation modeling, allowing for seamless operation and superior user experience.

Advanced Fan-Out Panel Level Packaging (FOPLP)

ER's comprehensive solutions will also showcase processes capable of handling large panel sizes, with impressive control over warping up to 16 mm during laser marking, cutting, and other procedures. The process efficiency is further boosted by advanced laser stripping and plasma dry etching, essential for the separation processes in advanced glass substrates and panels.

Join Us at SEMICON SEA 2026

ER Engineering, in collaboration with HTA and GP, is emerging as a driving force in the semiconductor manufacturing sector, pushing boundaries towards greater efficiency, accuracy, and integrated solutions. Attendees to SEMICON SEA 2026 are invited to visit our booth (#1452) to explore how our pioneering technologies are shaping the future of semiconductor manufacturing and the wider electronics market.

Event Details:

• - Dates: May 5 – May 7, 2026
• - Location: Malaysia International Trade and Exhibition Centre (MITEC)
• - ER's Website: ER Engineering

By embracing these state-of-the-art technologies, ER Engineering aims not only to meet the immediate needs of the industry but also to set new standards for sustainability and innovation in the field of semiconductor manufacturing.