ER Engineering Showcases Cutting-Edge Laser and Plasma Solutions at SEMICON SEA 2026
ER Engineering Showcases Cutting-Edge Laser and Plasma Solutions at SEMICON SEA 2026
Next week, ER Engineering (8027.TW) is set to unveil advanced laser and plasma technologies at the highly anticipated SEMICON Southeast Asia 2026 event. This showcase aims to address critical demands in artificial intelligence (AI), chip packaging optimization (CPO), and next-generation manufacturing processes.
In collaboration with notable partners such as Horng Terng Automation (HTA) and Group Up Industrial (GP), ER Engineering plans to deliver comprehensive turnkey solutions that promise to elevate semiconductor technologies.
Highlights of ER's Technology for 2026
Advanced Laser and Plasma Packaging
ER Engineering is focusing on several key innovations that redefine what is possible in semiconductor manufacturing. These include:
- - High-Precision Laser Drilling: For 2.5D/3D integrated circuits with a precision of ±5 μm and a back-to-top ratio of up to 90%.
- - Multi-Beam Laser Marking: Achieving a precision of ±25 μm with high throughput.
- - Controlled Thermal Laser Cutting: Ensuring clean and efficient edges for various applications.
- - Microwave and RF Plasma Cleaning: Ideal for pre-encapsulation, surface activation, as well as redox oxidation.
- - Hybrid Plasma Solutions: Delivering efficient dry etching capabilities.
Automation Integration Services (AIS) and Tailor-Made Solutions
With over 30 years of expertise, ER Engineering excels in providing custom automation solutions that meet the complex requirements of computer-integrated manufacturing (CIM). By seamlessly integrating process modules from multiple suppliers into a unified, highly efficient system, they ensure that clients receive a streamlined user interface along with a single point of contact for support.
Specialized R&D and sales teams facilitate direct communication, guaranteeing effective technical support for each project. One noteworthy offering is the Fan-Out Panel Level Packaging (FOPLP) solution that caters to large panel processing. This includes laser marking, laser cutting, laser waste removal, plasma cleaning, and post-drilling stain removal, with exceptional warpage control of up to 16 mm. Furthermore, the process can be optimized using laser stripping solutions combined with dry plasma etching, effectively facilitating the separation of glass substrates from panels.
Event Details
Join ER Engineering, HTA, and Group Up at the SEMICON SEA 2026 event to discover how their collaborative efforts position the future of semiconductor manufacturing. Attendees can look forward to solutions that are not only more precise and efficient but also highly integrated into existing manufacturing workflows.
- - Booth Number: #1452
- - Location: Malaysia International Trade and Exhibition Centre (MITEC)
- - Date: May 5-7, 2026
- - Website: ER Engineering
As the semiconductor market continues to evolve, innovations presented by ER Engineering will certainly play a pivotal role in shaping the industry's future, making this event a must-attend for professionals in the field.
Topics Consumer Technology）
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