#USA #AI #Greer #PowerOne #Airsys Cooling

Airsys Unveils PowerOne™ AI-Era Cooling Solutions

Airsys Cooling Technologies Inc., recognized as a frontrunner in mission-critical cooling solutions, has recently introduced its latest innovation: PowerOne. This sophisticated cooling framework addresses the escalating cooling requirements facing data centers as they adapt to the growing prevalence of AI, hyperscale, and high-density computing environments.

Meeting Modern Cooling Demands

PowerOne is a fully modular and efficient cooling architecture engineered to accommodate workloads ranging from smaller edge deployments with a capacity of 1 MW to expansive hyperscale environments exceeding 100 MW. This adaptation aligns with data from Horizon Grand View Research, predicting that the North American data center cooling market is set to reach around $15 billion by 2030, with cooling systems consuming up to 60% of total energy in densely populated data environments.

Airsys’ CEO and founder, Yunshui Chen, states, "With PowerOne, we're redefining what a cooling system should do," emphasizing that this innovation is tailored not merely for energy efficiency but for optimizing operational performance while simultaneously reducing costs and boosting sustainability.

Key Features of PowerOne

PowerOne’s design eliminates conventional capacity limitations, introducing unprecedented agility for data centers grappling with challenges concerning power density and energy efficiency. The solution comprises two main cooling strategies intended to address various operational needs:
1. Standard Cooling Stack: This modular setup is optimized for high efficiency across artificial intelligence (AI), high-performance computing (HPC), and enterprise sectors. It includes components such as:
- CritiCool-X™: A high-efficiency magnetic bearing centrifugal chiller designed for effective air/liquid hybrid cooling.
- FluidCool-X™: A precision cooling unit engineered to handle dense computing workloads.
- MaxAir™: A compact, performance-driven fan wall solution.
- Optima2 CW™: A cooling unit specifically optimized for high-density computing environments.

2. LiquidRack™ Solution: This features a single-phase liquid spray cooling architecture tailored for the AI era, facilitating compressor-less cooling paired with:
- AdiaCool™: Dry coolers providing high free-cooling utilization without compressors.
- CritiCool-X™: Compatibility for chiller-based configurations in more extreme climates.

Built for the Future

Designed explicitly for the AI era, PowerOne is capable of managing revolutions in power density, fending off the scalability and cost restrictions often seen in contemporary cooling solutions. Traditional systems frequently struggle under the weight of excessive energy consumption and ascending operational costs. However, PowerOne’s innovative architecture and intelligent control systems tackle these issues head-on, achieving a targeted Water Use Efficiency (WUE) of 0, industry-leading Power Usage Effectiveness (PUE), and optimal Power Compute Effectiveness (PCE).

PCE is an emerging metric critical for gauging the effectiveness of compute resources in AI-driven data centers. While PUE focuses on reducing overhead associated with cooling, PCE measures how effectively the power allocated translates into executable compute tasks. This dual focus allows operators to maximize compute density while minimizing detrimental impacts on infrastructure expansion.

Versatile Deployment Options

The modular nature of PowerOne makes it suitable for new data center builds, refurbishment initiatives, and legacy facility upgrades in both air and liquid cooling scenarios. This flexibility permits adjustments in cooling capabilities precisely to mirror computational progress.

"Airsys is transforming the cooling industry by engineering solutions that bolster the world's crucial digital infrastructure," asserts Chen. He adds, "As the demands for AI and connectivity continue to flourish, Airsys is committed to ensuring the systems driving the modern world stay efficient and adaptable."

PowerOne is set to launch with a robust warranty program aiming to establish a new standard within the industry, with further details expected soon. Pre-orders are currently open, with the first select products anticipated to be available in Q4 2025. Customers can access these solutions via the Airsys website or through designated representatives worldwide.

Launching Aegis for Innovation

In tandem with the PowerOne introduction, Airsys is also unveiling Aegis, a strategic initiative that focuses on liquid cooling innovation within the company. Aegis aims to rapidly develop and implement sophisticated cooling components tailored for the evolving needs of advanced computing environments through cutting-edge 3D manufacturing techniques.

Airsys's team will showcase PowerOne at the SC25 Conference in St. Louis from November 17-21 at booth 6605.

A Brief About Airsys

With over 30 years of technical expertise, Airsys specializes in engineered thermal solutions for mission-critical cooling. The company is grounded in a commitment to efficiency and sustainability, providing high-performance cooling systems that support various demanding environments, from AI to advanced manufacturing. For more information, please visit airsysnorthamerica.com.