Spirox Revolutionizes Glass Substrate Inspection with New TGV Crack Inspection Technology

In a significant development for the semiconductor industry, Spirox Corporation has unveiled the SP7000G High-Speed TGV Crack Inspection System during the recent Advanced Packaging Technology Forum. This event, held on September 8, 2026, gathered industry leaders and experts from companies such as Corning, DNP, and GIGABYTE. Together, they discussed innovations in glass core technology and the critical importance of TGV—Through Glass Via—in next-generation packaging solutions designed for advanced artificial intelligence (AI) and high-performance computing (HPC) applications.

At the forum, recognized figures shared vital perspectives on challenges and advancements within the realm of glass core technology. Odessa Petzold from Corning emphasized the significance of innovative inspection solutions like Spirox's laser tomography scanning technology. This approach facilitates non-destructive inspections, allowing for the detection of defects within glass structures without damaging those essential materials. Such capabilities are increasingly crucial as the industry shifts towards high-volume manufacturing processes, particularly for TGV applications.

Satoru Kuramochi from DNP also voiced the rising importance of reliability and failure analysis as the demand for high-density packaging solutions grows. He highlighted how these advancements are necessary for maintaining the performance and dependability of Glass Core technologies, which are integral to large AI server packages. With the increase in production demands, the role of non-destructive inspection methods becomes more prominent in identifying and analyzing potential defects throughout various manufacturing stages.

The SP7000G is engineered to significantly enhance inspection efficiency. It can conduct a full-panel scan on a large 510 mm × 515 mm glass substrate in under 20 minutes. This rapid inspection process is vital for detecting internal microcracks that may arise after critical production steps such as metallization and ABF build-up. By improving the quality monitoring processes, Spirox aims to optimize manufacturing yields and quality control measures.

Paul Yang, representing Spirox Corporation, reflected on the necessity of this technology in an evolving manufacturing landscape. “As TGV technology progresses towards high-volume manufacturing, enhancing inspection efficiency and quality is imperative to meet production demands,” he remarked. The new SP7000G system complements Spirox's existing SP8000G, offering a comprehensive suite of solutions tailored for thorough, high-speed, and non-destructive TGV inspection and analysis in research, development, quality assurance, and large-scale production environments.

As the forum concluded, the collective knowledge shared by industry leaders reinforced the growing significance of reliable inspection technologies in fostering the advancement of Glass Core and TGV technologies. This evolution is crucial as industries increasingly depend on efficient and effective manufacturing methods to support the burgeoning demands of AI and HPC applications. Spirox Corporation looks forward to ongoing developments and collaborations aimed at bolstering its inspection technologies, thus facilitating the industry's transition to high-volume manufacturing of next-generation packaging technologies.