#Taiwan #Hsinchu #Glass Technology #Spirox #TGV Inspection

Spirox Introduces Revolutionary TGV Crack Inspection System

In a significant advancement in the realm of packaging technology, Spirox Corporation (TWSE: 3055) unveiled their cutting-edge high-speed TGV crack inspection system, model SP7000G. This introduction took place during the 2026 Advanced Packaging Technology Forum, which attracted industry leaders and experts from renowned companies like Corning and DNP. The focus of this forum was to address the evolving needs of Glass Core and TGV technologies in the context of next-generation artificial intelligence (AI) and high-performance computing (HPC) applications.

The SP7000G system is designed to perform comprehensive scans of glass substrates, measuring 510 mm x 515 mm, in under 20 minutes. This rapid scanning capability is vital for detecting inner micro-cracks that may occur during metallization and ABF assembly processes. With a unique laser tomography scanning approach, the SP7000G can identify defects without causing any damage to the material, marking a significant milestone in non-destructive testing methodologies.

Paul Yang from Spirox expressed excitement about the mass production trajectories of TGV, underscoring the necessity for improved inspection efficiency and quality control in production. He pointed out that the SP7000G complements Spirox’s existing SP8000G model tailored for research and quality control. By optimizing inspection processes, Spirox aims to boost process quality while monitoring defect distribution, ultimately maximizing yield rates in production lines.

As AI, HPC, and high-bandwidth memory (HBM) technologies accelerate the demand for advanced packaging solutions, industry experts at the forum discussed the critical nature of reliability and failure analysis in the manufacturing of high-density packaging. Odessa Petzold from Corning emphasized the role of new inspection technologies in addressing challenges faced in real-world applications and enhancing the reliability of Glass Core substrates for AI data server packages.

Satoru Kuramochi from DNP highlighted that with AI servers driving the need for high-performance packaging, reliability in manufacturing processes has never been more important. Non-destructive testing technologies like the SP7000G are essential not only for error detection but also for comprehending the intricacies of problems arising at various stages of production. Emphasizing the importance of advancements in testing and analysis technologies, he reaffirmed their potential to foster the development of a comprehensive technology ecosystem crucial for the reliability of Glass Core technologies.

As the drive for mass manufacturing continuity gains momentum, Spirox’s investment in innovative inspection technologies signifies a proactive response to industry challenges. The company is set on expanding its inspection capabilities to support clients in their quest to mass-produce next-generation packaging technologies, ensuring that quality and efficiency remain uncompromised amidst increasing production scales.

The advancements showcased at the forum not only highlight Spirox’s commitment to leading the charge in inspection technology but also reinforce the collaborative efforts needed across the industry to meet the evolving demands of future technologies. With its high-speed TGV crack inspection system now operational, Spirox appears poised to redefine standards in the glass substrate inspection market, favoring a future where reliability and efficiency go hand-in-hand in achieving mass production success.