#Taiwan #Hsinchu #Glass Substrate #Spirox #TGV Inspection

Spirox Launches SP7000G for Advanced Glass Substrate Inspection

On September 8, 2026, at the Advanced Packaging Technology Forum, Spirox Corporation unveiled its latest innovation: the SP7000G High-Speed TGV Crack Inspection System. This cutting-edge technology is set to revolutionize the inspection of Glass Core and TGV (Through Glass Via) manufacturing, catering particularly to the demands of high-volume production due to the rising needs of artificial intelligence (AI) and high-performance computing (HPC) applications.

The forum gathered prominent industry experts, including representatives from Corning and DNP, who shared insights about the challenges and advancements in Glass Core and TGV technologies. As industries prioritize rapid advancements in AI and HPC sectors, the significance of reliable and efficient inspection systems cannot be overstated.

Odessa Petzold from Corning emphasized the critical role that Spirox's laser tomography scanning technology plays, noting that it provides a non-destructive inspection method for glass materials. The ability of SP7000G to detect internal defects without compromising the integrity of the glass structure represents a major leap forward in advanced packaging processes for TGV.

Satoru Kuramochi, who spoke on behalf of DNP, pointed out that as the demand for robust AI servers increases, the reliability of Glass Core technologies becomes paramount. The quest for high-density packaging continues to challenge manufacturers, thus rendering non-destructive inspection methods essential throughout various manufacturing stages. As Kuramochi explained, continued enhancements in inspection and analysis technologies will not only improve reliability but also foster a more comprehensive innovation ecosystem.

The SP7000G promises remarkable performance, capable of performing a full-panel scan on a glass substrate measuring 510 mm x 515 mm in less than 20 minutes. This rapid scanning capability addresses the urgent need for efficient detection of internal microcracks that can occur after metallization and ABF (Ajinomoto Build-up Film) build-up processes. With its advanced functionalities, the SP7000G aims to enhance inspection efficiency, monitor production quality, and optimize overall yields, providing manufacturers with vital insights into defect distributions.

Paul Yang from Spirox highlighted that as the industry transitions toward high-volume TGV manufacturing, the need for enhanced inspection efficiency and stringent quality control measures becomes even more critical. The SP7000G is not just an addition; it enhances the existing SP8000G, presenting a complete solution for high-speed, precise, and non-destructive inspection of TGV technologies across research and development, quality control, and mass production phases.

Through the launch of the SP7000G, Spirox reinforces its commitment to advancing proprietary inspection technologies. This boosts the capacity to assist clients in navigating the complexities of high-volume manufacturing processes for next-generation packaging technologies. As we witness the fusion of AI, HPC, and stringent manufacturing requirements, the innovative developments in inspection systems like the SP7000G signal a new era of operational excellence in the tech industry.

Spirox is poised to remain at the forefront of advanced inspection technologies, ensuring that as manufacturing evolves, both quality and efficiency are upheld, paving the way for sustainable innovation.