Spirox Unveils High-Speed Crack Inspection System for TGV Applications

Spirox's Groundbreaking High-Speed Inspection System for TGV



On September 8, 2026, Spirox Corporation, listed on the Taiwan Stock Exchange (TWSE: 3055), unveiled its new high-speed crack inspection system, the SP7000G, designed specifically for TGV applications. This announcement took place during the 2026 Advanced Packaging Technology Forum, an event that brought together industry experts including representatives from Corning and DNP to discuss the future of glass core and TGV technologies in the realm of artificial intelligence and high-performance computing.

The advanced SP7000G system is engineered to streamline the quality control processes in the production of glass substrates, crucial for the reliable manufacture of TGV technology. With its ability to scan a glass substrate measuring 510 mm x 515 mm in under 20 minutes, this system effectively identifies microcracks that may arise during metallization and build-up processes. The need for such advanced inspection techniques highlights the increasing complexity and scale demands in modern manufacturing, particularly for AI and data center applications.

Corning's Odessa Petzold emphasized the significance of the SP7000G, stating, "Spirox's laser tomography scanning technology represents an innovative method for non-destructive testing of glass materials. Its unique optical inspection capabilities allow for the detection of defects within glass structures without causing damage, making it an essential tool for advanced encapsulation processes like TGV. This not only enhances process reliability but also accelerates the shift towards mass production.”

The demand for high-density and high-performance packaging solutions continues to grow, particularly as AI servers drive increased need for these technologies. DNP's Satoru Kuramochi noted, “As Glass Core technologies advance towards large-scale production, reliability and failure analysis will be increasingly critical. Our collaborative involvement in this forum helps foster advancements in Glass Core substrates intended for high-performance AI data server enclosures.”

On the topic of inspection efficiency, Paul Yang from Spirox explained, “With TGV moving toward large-scale manufacturing, effective quality controls are vital for production success. The SP7000G, alongside our SP8000G system designed for R&D and quality control analysis, offers our clients the ability to perform faster and more precise non-destructive inspections across entire substrates. Spirox is committed to enhancing our proprietary inspection technologies to support our clientele in rapidly advancing the production of next-gen encapsulation technologies.”

As industries evolve into the age of AI and high-performance computing, Spirox's commitment to innovation in inspection technology positions it as a significant player in the semiconductor and electronics sectors. The launch of the SP7000G is expected to set a new standard in quality assurance practices, driving improvements across supply chains and production lines where glass substrates are pivotal. Spirox's focus on reliable, high-speed inspection systems not only streamlines manufacturing but also ensures that new technologies can meet the rigorous demands of tomorrow’s applications.

In conclusion, Spirox's new inspection system for TGV reinforces its role as a leader in quality assurance technologies, demonstrating a proactive approach to meeting the needs of an evolving tech landscape. With continued investment in innovative solutions, Spirox aims to drive the production of advanced packaging technologies while maintaining the highest quality standards.

Topics Consumer Technology)

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