Unveiling New Edge AI Solutions: DFI at Embedded World 2025

DFI's Cutting-Edge Innovations at Embedded World 2025



As the world continues its rapid technological advancement, DFI, a prominent leader in embedded motherboards and industrial computing, is gearing up to make waves at Embedded World 2025. Scheduled from March 11 to 13 at Messe Nuremberg, DFI's booth (3-533) will be a hub of innovation, highlighting impressive new edge AI solutions tailored for various sectors, including smart cities, industrial automation, intelligent transportation, and healthcare.

Driving Towards a Sustainable Future


With the overarching theme of "Accelerating Edge AI Innovation for a Sustainable Future," DFI is set to demonstrate how advanced technology can help solve some of our most pressing challenges. Central to their presentation will be hybrid AI Box solutions powered by leading technologies from Intel and NVIDIA Jetson. These solutions are designed to integrate AI with Out-of-Band (OOB) remote management, ensuring energy-efficient edge computing, vital in today’s eco-conscious world.

Cutting-Edge Technology Unveiled


Among the key offerings, DFI will showcase a variety of powerful edge AI platforms. These include Intel, AMD, and ARM-based solutions equipped with AI accelerators from industry giants such as Intel, NVIDIA, DEEPX, and Hailo. This approach ensures scalable, energy-efficient computing capabilities across different applications.

In collaboration with Chunghwa Telecom, DFI aims to present the X6-MTH-ORN hybrid AI Box. This innovative module will enhance security and traffic management while also providing environmental protection through AI-driven monitoring and enforcement systems. With capabilities that leverage Intel and Jetson platforms, this hybrid AI Box is designed for maximum efficiency and performance in real-world scenarios.

Rugged Solutions for Harsh Environments


DFI’s commitment to reliability is evident in their rugged platforms. The ECX700 series is specifically designed for mission-critical durability, while the QRB812 OSM module, measuring an ultra-compact 45mm × 45mm, incorporates Qualcomm QRB5165 technology, making it ideal for applications in smart surveillance, UAVs, and automated inspections. DFI's active involvement in UAV projects is set to yield significant advancements in how these technologies can be utilized in various sectors.

In addition, DFI has partnered with Irontech Group, a renowned Spanish brand, to showcase rugged panel PCs designed for extreme environments, such as marine and food industries, logistics, and industrial automation.

Expanding AI Capabilities


A notable highlight at DFI's booth is the EC633D-RPS, an expandable, fanless embedded system compatible with 65W 14th/13th/12th Gen Intel® Core™ processors and a high-performance GPU. This system facilitates the deployment of on-device large language models (LLMs) using DeepSeek technology, a feature increasingly important in AI applications.

The edge server lineup will also include the MPC350-RPS, a medical-grade AI server with RTX5070 GPU support, and the RM646-ERX810, a 4U short-depth AI server featuring dual 5th Gen Intel® Xeon® processors alongside three PCIe GPUs. Moreover, DFI is collaborating with AEWIN to unveil the BAS-6101A, a robust 2U edge server engineered for cloud and high-performance computing needs. DFI’s partnership with DEEPX to integrate the DX-M1 M.2 AI accelerator into the EC700-ADN system showcases their ongoing commitment to enhancing AI performance.

Join DFI at Embedded World 2025


With so many revolutionary advancements on display, DFI's participation at Embedded World 2025 promises to set standards in the embedded computing and edge AI landscape. Attendees are encouraged to visit Booth 3-533 to see firsthand how DFI is making strides in intelligent technologies that pave the way for the future.

As businesses and industries continue to seek sustainable and effective technological solutions, DFI stands ready to lead the charge, harnessing the power of edge AI to create smarter, safer, and more efficient environments for all.

Topics Consumer Technology)

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