#Switzerland #VITA 67.3 #HUBER+SUHNER #MINIBEND #Herisau

HUBER+SUHNER Unveils the VITA 67.3 Interconnect Portfolio

HUBER+SUHNER, a prominent player in the connectivity solutions market, has launched its innovative VITA 67.3 interconnect portfolio. This new suite is geared towards meeting the stringent requirements of the aerospace and defense sectors, leveraging cutting-edge solderless MINIBEND® technology for radio frequency (RF) cable terminations.

A Game-Changer in Connectivity

The VITA 67.3 interconnect solutions are designed to address the ongoing miniaturization trends in the aerospace and defense industries. With an emphasis on high reliability and performance, these solutions provide engineers with the tools necessary to manage high-frequency signal transmissions effectively. The introduction of standard blind-mate RF interfaces at the backplane significantly reduces cable management issues and enhances system modularity, making it easier for professionals to adapt and innovate in this fast-evolving field.

Joining The Open Group's SOSA Consortium and the VITA Standards Organization, HUBER+SUHNER has established itself as a trusted supplier of high-performance connectivity solutions. Their MINIBEND® technology stands out in the industry as one of the most versatile and low-profile flexible cable assembly options available, which is crucial for the demanding aerospace applications.

Key Features of the VITA 67.3 Portfolio

• - Wide Range of Options: The portfolio includes various interfaces such as NanoRF, SMPM, and SMPS, all delivered as drop-in assemblies. This comprehensive approach ensures that users have access to highly tailored solutions for their needs.
• - Versatile Cable and Connector Choices: HUBER+SUHNER offers the broadest range of connector options for both printed circuit boards (PCBs) and chassis connectivity, which can support high frequencies up to 65 GHz.
• - Low Loss Cable Options: For demanding applications, the portfolio features robust .047- and .086-size cable options, ensuring minimal signal loss and maintaining integrity over long distances.
• - Quality Assurance: Each assembly is manufactured following the IPC/WHMA-A-620 Class 3 standards, ensuring top-tier quality and performance.
• - Express Production Line: Need a rapid solution? Their dedicated express production line can create custom VITA 67.3 assemblies in as little as four weeks, empowering engineers to meet tight deadlines effectively.
• - Rugged Multiport Harnesses: Availability of multiport harnesses that support RF, fiber optic, and power/signal installations provides enhanced flexibility.

Contributing to Modular Engineering

The VITA 67.3 interconnect set offers significant benefits to engineers working in complex systems. By providing reliable, high-frequency connections that can be easily managed and adapted, HUBER+SUHNER is facilitating the construction of advanced modular systems that are modular, scalable, and easy to maintain. This is especially vital in sectors where performance and reliability are non-negotiable.

Conclusion

With the launch of the VITA 67.3 RF interconnect portfolio, HUBER+SUHNER continues to lead the way in providing high-performance connectivity solutions that meet and exceed the industry's rigorous benchmarks. This innovation not only enhances the functionality and reliability of aerospace and defense systems but also aligns with the industry's push for more efficient, modular designs in an increasingly competitive landscape.

To learn more about HUBER+SUHNER and their new interconnect solutions, visit their official website.