#South Korea #Daejeon #Tomocube #3D Defect Analysis #HT-T1

Tomocube Unveils HT-T1 Desktop for Advanced Glass Substrate Analysis

In a significant advancement for the semiconductor packaging industry, Tomocube, a pioneering company in non-destructive 3D inspection and metrology, has officially launched the HT-T1 Desktop (HT-T1D). This innovative desktop holotomography system is engineered specifically for high-resolution 3D defect analysis of glass substrates, a crucial component in cutting-edge semiconductor applications.

The Importance of Glass Substrates

As technology progresses, the demand for advanced packaging solutions that can accommodate high bandwidth memory and AI accelerators grows. Glass core substrates and interposers are increasingly recognized for their strategic role in this evolution. However, with the shift towards mass production, manufacturers are confronted with the challenge of efficiently identifying the root causes of micro-defects that can emerge during complex production processes such as laser drilling and metallization. A single overlooked defect can result in the scrapping of an entire unit, making effective analysis imperative.

How HT-T1D Revolutionizes Defect Analysis

The HT-T1D is optimally designed for inspecting glass substrates within metrology workflows. When conventional in-line panel inspection tools identify a possible defect, the HT-T1D takes action by using the specific coordinates to analyze and reconstruct a detailed 3D image of the internal structure of the glass substrate. This allows engineers to observe the location, morphology, and depth characteristics of defects, providing insights that traditional surface inspection methods simply cannot achieve.

Tomocube's approach utilizes visible-light holotomography, boasting a refractive-index sensitivity of 10⁻⁴. The non-destructive nature of this system permits repeated measurements at the same location across different process stages. Consequently, it allows users to monitor how defects develop from initiation to potential enlargement, significantly shortening the typical defect-analysis cycles previously dependent on destructive methods, which could take days or even weeks.

Introducing TAMI: The Analysis Software

Complementing the HT-T1D, Tomocube has also launched the TomoAnalysis MI (TAMI), a sophisticated 3D analysis software platform. TAMI is capable of quantitatively analyzing 3D refractive-index volume data and producing structured reports essential for engineering reviews. The software seamlessly integrates data from other Tomocube systems, establishing a unified workflow that spans from research and development to production-line evaluations.

YongKeun Park, CEO of Tomocube, emphasizes that understanding defects quicker is vital for manufacturers. He states, "HT-T1D is not just about detecting defects; it empowers our customers to delve deeper into identifying root causes, thereby enabling them to refine their process conditions. The technology aims to become an indispensable tool for enhancing yield learning in glass substrate manufacturing."

Expanding Horizons

The capabilities of the HT-T1D extend beyond mere defect analysis. The system also holds potential for applications in glass photonic integrated substrates crucial for co-packaged optics. Since the refractive index directly influences device performance, such versatility positions the HT-T1D as a multifunctional platform within the semiconductor landscape.

With this launch, Tomocube seeks to collaborate with manufacturers of glass substrates and advanced packaging solutions. The goal is to foster comprehensive workflows for defect analysis, process review, and learning enhancements that cater to the ever-growing demands of semiconductor innovations. As the company continues to expand its offerings in glass-substrate inspection and metrology, it stands at the forefront of revolutionizing how the industry engages with defect analysis and yield learning methodologies.

For more information on Tomocube's revolutionary products and their implications for the semiconductor packaging sector, visit Tomocube.