#South Korea #Daejeon #Tomocube #HT-T1D #3D Analysis

Tomocube's Groundbreaking HT-T1 Desktop Launch

In an impressive stride for non-destructive inspection technology, Tomocube has announced the launch of its latest innovation, the HT-T1 Desktop (HT-T1D). This advanced holotomography system is specifically tailored for the detailed analysis of glass substrate defects, which are critical in next-generation semiconductor packaging.

The significance of the HT-T1D lies in its capability to conduct high-resolution 3D analyses that expose the internal structure of glass substrates. By leveraging sophisticated imaging techniques, this machine can pinpoint the location, morphology, and depth profiles of defects that conventional surface inspections might miss. This capability is especially vital as manufacturers navigate the complex challenges of mass-producing glass substrates, a key material in advanced packaging applications.

Substrates with a glass core and glass interposers are gaining traction due to their performance enhancements in AI accelerators and High Bandwidth Memory (HBM) technologies. Yet, the production of these substrates is fraught with the potential for micro-defects to arise during intricate fabrication processes, including laser drilling and etching. A single critical defect can render an entire unit unusable, making the rapid identification and analysis of such issues essential for maintaining production efficiency.

Features and Benefits of the HT-T1D

The HT-T1D system utilizes Tomocube's cutting-edge visible light holotomography technology, which boasts an extreme sensitivity of $10^{-4}$ in measuring the refractive index distribution within the material. This non-destructive approach allows for the examination of the same locations repeatedly during different stages of production, enabling real-time tracking of defect evolution, whether it’s formation, propagation, or escalation.

Traditionally, defect analysis relied heavily on destructive methods that could take days or weeks to yield results. The HT-T1D simplifies this process, reducing analysis times to just minutes, which is incredibly advantageous in averting costly downstream complications. Alongside the hardware, Tomocube has rolled out TomoAnalysis MI (TAMI), a dedicated 3D analysis software platform that quantitatively assesses volumetric data of the refractive index and generates structured reports for technical review. Notably, TAMI also accommodates data from future inline integration modules, facilitating a seamless transfer of information from research and development to final inspection on the production line.

Enhancing the Production Process

YongKeun Park, CEO of Tomocube, emphasized the critical role of glass substrates in semiconductor packaging. He stated, "The true competitive edge in mass production will depend on how quickly manufacturers can comprehend defect issues and translate this knowledge into process enhancements." The HT-T1D not only focuses on detection but also aids clients in identifying root causes and refining manufacturing conditions with remarkable precision.

Moreover, the HT-T1D is versatile enough to extend its applications to integrated photonic glass substrates used in Co-Packaged Optics (CPO), where refractive index characteristics directly impact component performance. This versatility broadens the scope beyond mere defect analysis to address areas requiring functional metrology.

As part of its ongoing mission, Tomocube plans to collaborate closely with glass substrate manufacturers, advanced packaging companies, and system integration partners. This collaboration aims to enhance workflows associated with 3D defect analysis, process review, and yield optimization. Furthermore, Tomocube is committed to expanding its portfolio of non-destructive inspection and metrology solutions tailored for glass substrates, including upcoming inline modules to meet the growing global demand in advanced semiconductor packaging.

About Tomocube

Tomocube is at the forefront of developing innovative non-destructive 3D inspection and metrology solutions powered by holotomography technology. Building upon a deep expertise in optics and 3D imaging initially honed in bioimaging, the company successfully transitions into industrial markets including semiconductor packaging, displays, and glass substrates.

Forward-Looking Statements

This announcement contains forward-looking statements about product capabilities, potential customer applications, market opportunities, and Tomocube's business plans. These statements are based on current assumptions and expectations, subject to risks and uncertainties that may cause actual outcomes to differ significantly. Tomocube does not undertake any obligation to update these forward-looking statements unless required by applicable law.