#Japan #Tokyo #Semiconductor #CMC Research #packaging technology

Upcoming Live Seminar on Semiconductor Evolution

Date: August 5, 2026
Time: 13:00 - 16:30
Platform: Zoom (with materials provided)
Host: CMC Research
Instructor: Shigeru Koshibe, CEO of iPack Co.

Seminar Overview

Join us for a cutting-edge live seminar that focuses on the evolution of semiconductors and the accompanying advancements in packaging technologies. This event will address significant topics such as the transformation of joint structures and the corresponding resin sealing technologies to meet the demands of the next generation of devices, emphasizing tighter joint spacing and increased connections.

With industries driven by high-speed communication and AI, understanding these innovations is crucial for professionals in research, development, and manufacturing.

Highlights of the Seminar

1. Development of Semiconductor Packaging: Explore the history and latest trends in semiconductor packaging, focusing on the advancements that enhance reliability and performance.
2. Joint Structure Changes: Gain insights into how the evolving structure of semiconductor joints leads to changes in packaging technology.
3. Resin Sealing Technology: Learn about the development and challenges of resin sealing technologies that evolve in response to packaging advancements.
4. Question and Answer Session: Engage in discussions and clarify your queries with the expert instructor.

Registration Fees

• - General: ¥44,000 (tax included)
• - Newsletter Subscribers: ¥39,600 (tax included)
• - Academic: ¥26,400 (tax included)

Who Should Attend

• - Professionals in the semiconductor industry (Sales, Technical roles, etc.)
• - Individuals interested in semiconductor manufacturing technology (front-end and back-end processes)
• - Those curious about the evolution of semiconductor packaging and joint technologies
• - Participants keen on understanding Bumping Technology and its implications

Detailed Program

The seminar will include the following sessions:
1. Evolution of Semiconductor Package and Joint Structures
- High-density integration and its implications
- Various package types including WLP, PLP, and hybrid packages
2. Reliability and Verification of Joint Structures
- Methods for ensuring the reliability of connections and packaged semiconductors
3. Advancements in Sealing Technologies
- Development processes and challenges faced in sealing techniques
- Evaluation of sealing materials
4. Q&A Session
- Interactive discussion on the topics presented

How to Register

To participate, please visit the CMC Research seminar website for registration. A viewing URL will be sent via email after registration.
🔗 Register Here

For additional inquiries, feel free to reach out to the organizing team for more information.

This seminar promises to enhance your understanding of the future trends in semiconductor technology and improve your practical knowledge applicable to your professional work. Secure your spot today!