DB HiTek Announces Participation in PCIM 2026
DB HiTek, a prominent leader in the semiconductor industry specializing in 8-inch wafers, has declared its upcoming participation in PCIM Europe 2026. This highly anticipated event is set to take place from June 9-11 in the heart of Nuremberg, Germany. It marks a significant opportunity for the company to enhance its presence in the European market, which is witnessing rapid growth in power semiconductor technologies.
Following a successful debut at PCIM 2025, where DB HiTek engaged with numerous clients and discussed potential collaborations on process technologies, the company is aiming to capitalize on that momentum to build fruitful partnerships this year. Last year’s event was a resounding success, attracting over 1,000 visitors to DB HiTek's booth, and the company is optimistic that ongoing discussions will translate into tangible business outcomes in 2026.
At this year’s trade show, DB HiTek is set to unveil progressive advancements in its Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies. These innovations are crucial components of the company’s expanding portfolio. Additionally, DB HiTek will emphasize its leading BCDMOS (Bipolar-CMOS-DMOS) technology, which plays a pivotal role in its power management solutions. Scheduled meetings with global clients indicate a robust program focused on fostering collaboration and enhancing product offerings.
According to market research firm Yole Développement, the global markets for SiC and GaN power semiconductors are expected to witness explosive growth. Projections indicate that the SiC market will surge from approximately $4.8 billion in 2026 to an astonishing $10.4 billion by 2030, representing a compound annual growth rate (CAGR) of 21%. Concurrently, the GaN market is anticipated to expand from $900 million to $2.9 billion during the same timeframe, boasting a remarkable CAGR of 33%.
DB HiTek commenced production of Multi-Project Wafers (MPW) for its SiC and GaN processes in December 2025, producing samples for over ten customer products. Deliveries of these samples occurred between March and April 2026, with client evaluations currently underway. Feedback from these assessments will be crucial in finalizing the verification of the production process, with mass production slated to begin in 2027.
As of now, DB HiTek maintains mass production relationships with around 400 clients, primarily focusing on its flagship power semiconductor products. The company also exhibits strong collaborations with various clients utilizing specialized image sensor technologies such as X-rays, global shutter sensors, and Single Photon Avalanche Diodes (SPADs). This diversification illustrates the increasing alignment of DB HiTek's applications toward industrial and automotive sectors, reflecting the growing demand in these fields.
In conclusion, DB HiTek’s participation in PCIM Europe 2026 signifies its commitment to innovation and leadership in the semiconductor landscape. The showcase of advanced technologies not only reinforces its market position but also sets the stage for future collaborations that could reshape the future of power electronics.