#Germany #Nuremberg #DB HiTek #SiC #GaN

DB HiTek at PCIM 2026: Strengthening European Presence

Introduction

DB HiTek, a prominent manufacturer specializing in 8-inch semiconductor components, is set to participate in the upcoming PCIM (Power Conversion and Intelligent Motion) Europe 2026, Europe's largest power semiconductor exhibition. Scheduled from June 9 to 11 in Nuremberg, Germany, this event reaffirmed the company's commitment to expanding its footprint in the European market.

Building on Previous Success

After a successful debut at PCIM 2025, where DB HiTek engaged in substantial discussions with dozens of clients regarding their processing technologies and collaboration opportunities, the company is eager to strengthen these ties at this year's exhibition. With over 1,000 visitors engaging with their booth last year and ongoing business negotiations, DB HiTek anticipates that these relationships will yield tangible returns this year through ongoing partnerships.

Innovations in SiC and GaN Technologies

At this year's event, DB HiTek will present the advancements in their next-generation silicon carbide (SiC) and gallium nitride (GaN) technologies. Additionally, the company will highlight their leading-edge BCDMOS (Bipolar-CMOS-DMOS) technology, a vital element of their power management portfolio. Their extensive schedule of meetings with global clients underlines the growing momentum of collaborative initiatives in the power semiconductor market.

Market Growth Expectations

According to market research firm Yole Développement, global markets for power semiconductors, particularly SiC and GaN, are poised for rapid growth. The SiC market is projected to surge from approximately $4.8 billion in 2026 to $10.4 billion by 2030, reflecting a compound annual growth rate (CAGR) of 21%. Similarly, the GaN market is expected to grow from $900 million to $2.9 billion during the same period, indicating a robust CAGR of 33%.

Advancements in Sample Production

In December 2025, DB HiTek initiated its Multi-Project Wafer (MPW) processes for SiC and GaN technologies, successfully manufacturing samples for over 10 customer products. These samples were delivered between March and April 2026, with customer evaluations currently underway. Feedback from these clients will inform the final process validation, with full-scale production anticipated to commence in 2027.

Current Production and Future Directions

DB HiTek is maintaining mass production for roughly 400 clients, with an emphasis on their core power semiconductor products. Additionally, the company is collaborating with a diverse client base through specialized imaging sensor technologies, including X-ray, global shutter, and SPAD (single-photon avalanche diode) technologies. Their application field is increasingly shifting towards industrial and automotive products, reflecting the rising demand from these sectors.

Conclusion

As DB HiTek prepares for PCIM 2026, it aims to showcase its innovations and solidify its position in the European semiconductor market. With a strong history of client engagement and promising growth projections, the company is well-positioned to meet the evolving needs of the power semiconductor industry.