#Taiwan #Kaohsiung #ER Engineering #SEMICON Taiwan #Laser Drilling

E&R Engineering Showcases Advanced Semiconductor Technologies at SEMICON Taiwan 2026

E&R Engineering Corp., a leading player in semiconductor processing technology, made headlines at the SEMICON Taiwan 2026 event held from September 2 to 4. With a focus on high-precision laser drilling and hybrid plasma technologies, the company aims to address the escalating demands of optical communication and advanced packaging in the semiconductor industry.

Cutting-Edge Laser Drilling Solutions

Among the standout innovations presented at the exhibition is E&R's high-precision laser drilling system specifically engineered for Fiber Array Units (FAU). This solution accommodates high-density optical components crucial for high-speed optical communications and Co-packaged Optics (CPO). The FAU drilling technology employs a five-axis laser control system, achieving a remarkable drilling precision of ±0.5 μm. This capability not only facilitates diverse geometries and drilling angles but also supports bandwidths of 3.2 Tbps, 6.4 Tbps, and 12.8 Tbps, thereby meeting the rigorous standards of modern optics demands.

Advancements in Glass Substrate Processing

As the semiconductor industry pivots towards more intricate designs driven by AI and HPC, the significance of glass substrates has surged. E&R Engineering provides specialized laser solutions for glass core substrates and Through-Glass Vias (TGV), ensuring high precision and process stability. For glass support applications, the company offers processes such as de-bonding, surface cleaning, and polymer residue removal to maintain high cleanliness standards.

In addition to these advancements, E&R Engineering supplies precision cutting services for large glass panels and ABF routing for advanced packaging applications, paving the way for innovative semiconductor solutions.

Hybrid Plasma Technology: R-300R

Another highlight is the R-300R hybrid plasma system, which features an independent control mechanism for microwave (MW) and radiofrequency (RF) power sources. This flexibility enables tailored processing for various materials, covering tasks such as activation, cleaning, scum removal, and deep silicon etching, all with minimal damage—a crucial requirement in semiconductor manufacturing. The R-300R system is designed to cater to advanced packaging needs and next-generation materials.

Integration of Laser and Plasma Technologies

Under the theme “Laser Precision × Plasma Technology × Process Integration,” E&R Engineering is committed to providing high-precision equipment and integrated solutions tailored for the semiconductor manufacturing landscape. This includes support throughout the entire production phase, from R&D validation to large-scale production.

Faces of the Exhibition

Visitors to SEMICON Taiwan can find E&R Engineering in Hall 1, Booth M1048, where they can explore these state-of-the-art technologies firsthand. This event not only serves as a platform for showcasing innovations but also emphasizes E&R's dedication to enhancing the capabilities and efficiencies of semiconductor processing.

For more information on E&R Engineering’s offerings and to explore their latest advancements, please visit E&R Engineering's official website. As the industry continues to evolve, E&R remains at the forefront, driving innovation and excellence in semiconductor technology.