Great Lakes Semiconductor and APES Form Partnership for Advanced Semiconductor Packaging and Integration

Partnership Announcement

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have officially joined forces to advance the field of semiconductor packaging. This strategic collaboration focuses on enhancing design-to-manufacturing services, offering rapid production capabilities ranging from low to high volumes, while also supporting mass customization for GLS-fabricated semiconductor and sensor devices.

Establishing a Collaborative Hub

As part of this partnership, a joint research and development center is set to be established initially at the APES facility in Fishkill, NY. The plan is to gradually transition operations to GLS’s location, which will facilitate joint manufacturing efforts tailored to meet the growing demands in the semiconductor industry.

This partnership promises to integrate each company's innovative technology and manufacturing capabilities. Dr. Richard Thurston, CEO of GLS, emphasized the importance of combining their proprietary chip fabrication processes with APES’s advanced packaging solutions. This integration will allow for an effective and cohesive workflow in their manufacturing units, specifically within the GLS ChipForge™ units.

Enabling Technologies and Integration

Key technologies forming the foundation of this partnership include the GLS modular ChipForge™ semiconductor platform. Additionally, the collaboration will utilize APES’s suite of additive manufactured electronics (AME) solutions. A standout component is APES’s Matrix6D platform, a cutting-edge, AI-driven manufacturing system that is software-defined. This unique approach will enable the joint team to embed ChipForge™ semiconductor components into both rigid and flexible substrates. The potential applications of this technology span various industries, including autonomous vehicles, medical devices, robotics, and a multitude of commercial and defense-related products.

Dr. Rich Neill, CEO of APES, highlighted that this collaboration positions both companies to meet diverse needs across different sectors by integrating semiconductors and sensors into adaptable forms, enhancing design capabilities for future products.

Future Prospects and Implementation

Work under this partnership will commence immediately at APES’s labs and is anticipated to transition to GLS's facilities by the third quarter of 2026. Dr. Neill expressed optimism that leveraging the varied facilities for R&D, manufacturing, and comprehensive ecosystem support will stimulate local economic growth and development.

Dr. Thurston added that a primary goal is to consolidate all aspects of research and design services into a single operational space, focusing on chip manufacturing and package integration. Once this integrated model is confirmed to operate effectively, GLS plans to extend and scale this innovative manufacturing model to additional locations and potential international partners.

About the Companies

Great Lakes Semiconductor

GLS was co-founded by Dr. Richard L. Thurston and Jim Bark, with its headquarters in Fishkill, NY. Once their new facilities are fully operational, GLS aims to be a fully integrated semiconductor company (IDM) that addresses critical needs in the North American semiconductor sector. Their offerings will span from research and design services for chips and sensors, to modular equipment and advanced packaging technologies.

Advanced Printed Electronic Solutions

APES, led by Dr. Rich Neill and also based in Fishkill, New York, focuses on pioneering next-generation electronics production at the convergence of AME, automation, artificial intelligence, and software-driven systems. With an emphasis on enhancing design flexibility, reducing complexity, and accelerating product time-to-market, APES collaborates with both industry and research partners to advance semiconductor packaging technologies that serve a myriad of markets from aerospace to advanced computing.

For more insights into GLS, visit Great Lakes Semiconductor. For details on APES, check out their site Advanced Printed Electronic Solutions.