#Taiwan #AIoT #Zhubei #SOC #IntelPro

IntelPro and Ceva Join Forces for Cutting-Edge AIoT Solutions

In a significant move set to redefine the landscape of Internet of Things (IoT), IntelPro, a Taiwan-based semiconductor and AIoT solutions provider, has announced its latest collaboration with Ceva, Inc. This partnership has led to the development of the IPRO7AI system-on-chip (SoC), which boasts advanced capabilities ideal for smart homes, industrial applications, and consumer IoT devices. The announcement was made public on November 13, 2025, during a press release that highlighted the convergence of artificial intelligence (AI) and wireless connectivity.

The Need for Smart and Connected Devices

As we continue to witness technological advancements, the demand for innovative connectivity solutions is becoming more pronounced. Consumers and industries alike are seeking devices that not only provide functionality but also are capable of integrating seamlessly into the increasingly digitalized environmental landscape. The advent of low-power wireless technologies, together with the inclusion of AI, is opening doors to an entirely new range of possibilities for smart living and automation.

The IPRO7AI: A Game Changer

The IntelPro IPRO7AI is the first product launched under this collaboration, designed as a comprehensive platform that integrates wireless, security, multimedia, and AI processing technologies. This SoC incorporates Ceva-Waves Bluetooth® Low Energy 5, along with support for protocols such as 802.15.4, Thread, Zigbee, and Matter. By combining these features, IntelPro aims to deliver a Matter-ready solution that empowers developers and manufacturers to create innovative smart devices with enhanced connectivity and security.

Y.K. Lien, General Manager of IntelPro, emphasized the importance of this partnership, stating,