Inaugural Semiconductor Summit in Hong Kong: A Turning Point for Innovation Collaboration
Inaugural Semiconductor Summit in Hong Kong: A Turning Point for Innovation Collaboration
The Hong Kong University of Science and Technology (HKUST) has successfully launched the first-ever 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS), marking a pivotal moment in the semiconductor industry. Held in Hong Kong as a part of the university's 35th anniversary celebrations, the event attracted over 600 industry leaders, researchers, policymakers, and students from various regions, including the Chinese Mainland, the United States, Saudi Arabia, Germany, and Singapore. This summit not only underscores Hong Kong’s status as a global innovation hub but also highlights HKUST's vital role in semiconductor research and development.
The event was bolstered by support from the HKSAR Government, emphasizing the commitment to advancing the semiconductor sector. Prof. Tim CHENG Kwang-Ting, HKUST's Vice-President for Research and Development, expressed deep thanks for the government’s support, noting that it was essential for establishing this groundbreaking summit. He remarked, "Hong Kong, being a global financial center and one of the world's most internationalized cities, is perfectly positioned to serve as a venue for such significant events that foster collaboration among governments, industries, academia, and investors."
Strategic Importance of the Summit
Mr. Lung CHU, the Corporate Vice President of SEMI, spoke to the strategic importance of hosting the summit in Hong Kong. He noted, "This summit represents a blend of professional expertise and local insights, allowing SEMI to merge global industry resources with superior academic standards. This collaboration will enhance SEMI's influence in Hong Kong and benefit the global semiconductor community while propelling Hong Kong’s development as a leader in semiconductor innovation."
Showcasing Innovations at the Summit
A highlight of the summit was the HKUST Industry Engagement Day Plus, which featured an interactive experience zone. This area showcased groundbreaking technologies developed by research teams from HKUST and its Guangzhou campus. Among the remarkable innovations were:
- - Smart Rehabilitation Robotic System: This advanced robotic technology is designed to analyze human posture and movements in real-time, significantly enhancing the accuracy of rehabilitation therapies.
- - Next-Generation AR Display Technology: Featuring high-brightness, high-resolution, full-color Micro-LED microdisplays, these technologies, powered by quantum dot technology, are poised to revolutionize lightweight AR glasses.
- - Fully Integrated Digital Sensing Chips: With a ten-fold reduction in sensing area, power consumption, and costs, these chips are game-changers for IoT, wearables, digital healthcare, and Industry 4.0 applications.
Fostering Future Talent
In line with the government's dedication to promoting STEAM education, the summit also hosted five hands-on STEM workshops aimed at secondary school students. Over 100 students participated, engaging in practical activities like assembling miniature circuit components and delving into AI applications in coding design. These workshops were thoughtfully designed to ignite a passion for technology in young minds, nurturing the next generation of industry leaders.
The inaugural SIIAS not only set the foundation for future collaborations but also created a vibrant community among stakeholders in the semiconductor industry, emphasizing Hong Kong’s integral role in shaping the future of technology. The success of this summit marks just the beginning of a series of initiatives aimed at enhancing innovation within this critical sector.
Topics Consumer Technology）
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