M31 and TSMC Join Forces to Optimize eUSB2V2 Development on N2P Process

M31 Collaborates with TSMC on eUSB2V2

M31 Technology (M31), a recognized leader in silicon intellectual property (IP), has made a significant advancement by announcing the successful tapeout of its eUSB2V2 interface IP at the TSMC 2026 North America Technology Symposium. This achievement marks a pivotal moment in the ongoing evolution of advanced-node interfaces, reflecting M31's commitment to enhancing the design IP ecosystem.

With the continuous advancement of process nodes, System on Chips (SoCs) strive for greater computational density while achieving stricter energy efficiency standards. Consequently, the I/O interfaces must not only deliver high-speed data transfer but also ensure broad compatibility while operating at lower voltages within tighter power budgets. Equally important is maintaining signal integrity and manufacturability.

The eUSB2V2 interface was crafted through a thorough co-optimization approach, integrating design, circuit implementation, and physical layout to enhance power efficiency and performance while emphasizing area efficiency and integration flexibility. The interface maintains compatibility with the USB 2.0 ecosystem and demonstrates low-voltage operation at 1.2 V/0.9 V. Additionally, the analog front end is strengthened via programmable transmit de-emphasis and receiver equalization techniques, such as CTLE and VGA, contributing to improved channel robustness and design adaptability at advanced nodes.

Designed to support data rates of up to 4.8 Gbps, eUSB2V2 leverages an enhanced isochronous burst mechanism that boosts efficiency for simultaneous data transfers. It efficiently operates in asymmetric-bandwidth HSUx/HSDx modes while ensuring power consumption remains optimal at just 50 mW during standard operation.

Scott Chang, CEO of M31, emphasized the critical nature of optimizing IP on advanced process platforms, which streamlines design efficiency and reduces time-to-market. He also noted that the tapeout of eUSB2V2 on TSMC's N2P process reflects M31's platform-driven methodology, facilitating efficient integration of this vital interface, thus expediting the transition from design execution to production readiness, ultimately enhancing competitiveness at the 2nm node.

The milestone was attained through M31's deep collaboration with TSMC, focusing on advanced-node IP development, including alignment with platform design methodologies and fine-tuning circuits and layouts for optimal I/O performance. The availability of this validated IP on TSMC's advanced nodes elevates efficiency in interface integration, system verification, and product scheduling for mutual customers.

Looking ahead, M31 has ambitious plans to expand its expertise in developing its eUSB2V2 IP for TSMC's advanced process technology. The company's focus will continue to support growth areas such as AI, edge computing, and intelligent devices, while enhancing the long-term value of its IP platform.

This collaborative effort marks a significant step in achieving cutting-edge technology solutions that blend performance with power efficiency, crucial for a multitude of applications ranging from high-performance computing to mobile device connectivity.