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Longsys Innovates Integrated Storage Solutions at MWC 2026

At the Mobile World Congress (MWC) 2026, Longsys, a prominent player in the semiconductor memory market, showcased its latest integrated storage solutions designed to accelerate on-device artificial intelligence (AI) capabilities. Under the theme "AI Storage for the Mobile World", the company highlighted how its cutting-edge products are moving beyond basic functionalities to provide high-performance storage options tailored for AI applications across smartphones, wearables, and PCs.

Meeting Evolving Demands for AI-Enabled Devices

As AI terminals continue to evolve at a rapid pace, the need for storage technology that meets heightened demands for capacity, performance, and energy efficiency is more critical than ever. Longsys emphasizes that achieving a deep co-optimization of software and hardware is integral for advancing the integration at the system level. Leveraging its extensive expertise in driver designs, firmware algorithms, advanced packaging, and manufacturing, Longsys is transforming from a standard storage provider to a branded memory solutions company that offers integrated, value-added solutions.

During this year's MWC, they unveiled multiple storage solutions catering to mobile AI, portable AI, AI PC systems, and even robotics.

Cost-Effective High-Performance Storage for Mobile AI

In response to the dynamic landscape of DRAM supply and demand, Longsys introduced its patented High-Level Cache (HLC) technology integrated into UFS products. This innovation is designed to optimize the performance of UFS by effectively managing hot/cold data that has traditionally been cached in DRAM. As a result, it minimizes the DRAM requirements for terminals while optimizing the bill of materials (BOM) costs for AI-equipped smartphones, tablets, and robots, all while ensuring a seamless user experience.

Moreover, the integration of pTLC technology in Longsys's UFS line allows for intelligent mode switching between QLC, TLC, and SLC through firmware. This results in TLC-level data retention with cost advantages over native TLC, effectively balancing capacity, performance, and durability for demanding AI applications.

Ultra-Compact Storage Solutions for Wearables

Reflecting the surge in AI-integrated smart glasses and smartwatches, Longsys unveiled its latest ePOP5x, ePOP4x, and Subsize eMMC solutions. The new flagship, ePOP5x, retains the dimensions of its predecessor while achieving a remarkable 35% reduction in thickness, bringing it down to just 0.52 mm. It also doubles the DRAM speed to 8,533 Mbps and offers flexible capacity configurations, delivering the ultra-compact size and low power consumption essential for next-generation smart glasses.

High-Performance Storage for AI-Driven PCs

To address the data performance challenges in real-time for AI PCs, Longsys showcased its high-bandwidth, low-latency mSSD storage media. This technology has paved the way for Lexar, Longsys's premium consumer storage brand, to develop a pioneering sector architecture, the AI Storage Core. This enables flexible, high-capacity hot-swappable storage solutions and was demonstrated through new products like the AI-Grade Storage Stick designed for AI laptops and the AI-Grade SSD optimized for high-performance AI tasks.

By providing end-to-end capabilities that cover everything from controller design to media R&D, firmware, and manufacturing, Longsys is building a comprehensive storage ecosystem dedicated to delivering competitive integrated solutions that meet the diverse needs of the AI-era in-device innovation.

About Longsys

Founded in 1999, Longsys (301308.SZ) is a globally recognized leader in branded semiconductor memory that integrates R&D services, design, packaging, testing, manufacturing, and sales. The company stands by its corporate vision of "Everything for Memory." With a focus on innovation in memory technology, Longsys delivers comprehensive, tailored, efficient, and high-end services to global clients. For more information, visit Longsys's official website and follow them on LinkedIn, Facebook, and Twitter.