#ER Engineering #Laser Drilling #Hybrid Plasma

E&R Engineering Launches Innovative Technologies at SEMICON Taiwan 2026

E&R Engineering Corp. is set to make waves at SEMICON Taiwan 2026 by unveiling their latest advancements in semiconductor technologies. Focused on high-precision laser drilling and hybrid plasma solutions, the company aims to address the increasing demand for sophisticated optical components utilized in high-speed communication systems and Co-Packaged Optics (CPO).

Precision Laser Drilling Solutions

One of the standout offerings at the exhibition is E&R's high-precision Fiber Array Unit (FAU) laser processing solution. This technology is essential for achieving bandwidths in optical communications of 3.2 Tbps, 6.4 Tbps, and even 12.8 Tbps. The laser system utilizes five-axis control and advanced positioning techniques, boasting an impressive drilling accuracy of ±0.5 μm. This precision allows it to cater to a variety of hole geometries and processing angles, which is crucial for the design of cutting-edge optical systems.

Glass Core and Glass Carrier Processing

As AI and High-Performance Computing (HPC) continue to expand within the tech landscape, the demand for high-density interconnects has surged. E&R Engineering recognizes this trend and has developed specialized laser solutions for processing glass substrates. Their technologies for Glass Core substrates and Through-Glass Vias (TGV) demonstrate flexibility, accuracy, and process stability - key factors for semiconductor manufacturing today. Furthermore, they provide solutions for cleaning and processing Glass Carriers that eliminate contamination left over from temporary usage, ensuring the highest quality in the final product.

Cutting-Edge Laser and Plasma Systems

Two major systems will be featured at the exhibition: the PHB-600A and the R-300R Hybrid Plasma System. The PHB-600A is specifically designed for handling large-format glass panels. It meets the rigorous demands of high-precision laser processing necessary for today's advanced packaging needs.

The R-300R, on the other hand, incorporates a Hybrid MW-RF Plasma System with independent microwaves and radio-frequency power sources. This flexibility supports diverse materials and applications, enabling low-damage surface activations and processes like cleaning, descum, and deep silicon etching—all critical for semiconductor applications and new materials.

Integrating Laser Precision and Plasma Technology

E&R Engineering's innovative ethos is captured in their