Upcoming Seminar on Flexible Substrates and FPC Technology for 5G/6G

Upcoming Seminar on Flexible Substrates and FPC Technology

On April 15, 2026, from 1:30 PM to 4:30 PM, CMC Research will host an exciting live-stream seminar titled "Flexible Substrates and FPC Formation Technology for 5G/6G — The Evolution of LCP-FCCL". The event promises to bring together prominent figures in the field, offering a unique opportunity for professionals and academics alike to expand their knowledge and stay updated on the latest technological advancements in high-frequency flexible printed circuit (FPC) materials.

Seminar Overview

The demand for low-dielectric substrates for applications such as smartphones is on the rise. Current high-frequency substrate materials including Liquid Crystal Polymer (LCP) and Multi-layer Polyimide (MPI) may soon fail to meet the evolving dielectric property requirements. This seminar addresses the challenges and developments in materials such as porous constructions and low-dielectric fluoropolymer films to fulfill the needs of high-frequency responsive FPC materials. The session will explore the balance between maintaining essential properties for substrate formation and achieving low dielectric characteristics.

Learning Outcomes

Participants will gain insights into:

- Basic properties required for FPC substrates
- The reasons behind the usage of LCP and polyimide films in FPC applications
- Fundamental technologies for LCP multilayering
- Important considerations during LCP film processing
- Hybridization methods between LCP and low-dielectric materials

Who Should Attend

This seminar is tailored for development engineers engaged in the advancement of high-frequency FPCs and their substrates. Attendees can expect a blend of theoretical knowledge and practical insights, aimed at enhancing their expertise in the development and design of flexible substrates for electronic applications.

Featured Speaker: Hiroyuki Obata

Hiroyuki Obata from FM Tech will lead the seminar, drawing from his extensive experience in developing high-frequency FPC materials at notable companies such as Japan Gore-Tex and Murata Manufacturing. With a rich background in material science and a focus on hybrid material processes, he will provide valuable insights backed by industry knowledge.

Registration and Fees

The participation fee is structured as follows:

- General Admission: 44,000 JPY (including tax and materials)
- Newsletter Subscribers: 39,600 JPY (including tax)
- Academic Rate: 26,400 JPY (including tax)

For those unable to attend the live session, a recorded version will be available for a limited time, allowing for flexibility and convenience in viewing the material.

How to Register

Interested individuals can register through the CMC Research website. Following your registration, a link to the seminar will be provided via email, ensuring that you can access the live stream and the subsequent archive.

Join us for this informative session to gain insights that will shape the future of flexible substrates and FPC technology for the 5G/6G era. Don't miss your chance to engage in enriching discussions and ask your questions during the Q&A segment following the presentations!

For more details and to register, visit CMC Research Seminars.

In addition to this seminar, CMC Research regularly organizes informative webinars on various topics, including energy solutions, material sciences, and innovation in technology. Stay tuned for future events!