Sivers Semiconductors Secures $5.4M Chip Development Project for Telecom Infrastructure

Sivers Semiconductors Secures Major Telecom Chip Development Project

Sivers Semiconductors, a prominent player in the semiconductor industry, recently announced a noteworthy achievement: securing a substantial chip development program valued at $5.4 million. This ambitious project is in collaboration with a leading Tier-1 telecom infrastructure vendor and is set to run from the first quarter of 2025 through to the fourth quarter of 2026. Its primary focus is the development of a next-generation, highly integrated beamforming transceiver designed for various millimeter-wave telecom applications.

The significance of this development program cannot be understated. The new transceiver aims to integrate features from Sivers’ well-recognized RF-SOI-based SUMMIT beamformer product family, which is celebrated for its impressive output power, efficiency, and noise figure. These attributes contribute to longer-range, more reliable links, ultimately reducing operational costs and minimizing environmental footprints. Coupled with Sivers’ TRB transceiver technology, known for its advanced synthesizers and mixers with ultra-low phase noise, the impending product sets the stage for a new industry standard in the ultra-competitive millimeter-wave domain.

This new collaborative effort builds directly upon a previous agreement with the same customer, showcasing a solid commitment to establishing a sustainable and long-term product roadmap. The partnership not only signifies a cash injection of up to $2.3 million upfront, ensuring adequate working capital for development, but also brings forth a suite of SUMMIT and TRB products for the initial generation of this innovative telecommunications technology.

CEO of Sivers Semiconductors, Vickram Vathulya, expressed enthusiasm regarding the project, stating, "This award builds a stronger, deeper connection with a strategic customer in this millimeter-wave market segment. Winning this competitive bid is another testament to our differentiated beamforming technology and we value this trusted partnership as another step towards sustainable success in our journey."

Moreover, Harish Krishnaswamy, Managing Director of the Wireless Division at Sivers, emphasized the importance of this design win as it guarantees revenue generation and a solid product roadmap within the millimeter-wave telecommunications sector. He proudly noted that Sivers has successfully amassed design wins totaling nearly $18.5 million in recent months, marking a significant milestone for the company.

Sivers Semiconductors continues to expand its influence in the telecommunications industry, pledging to deliver high-performance solutions that not only meet but exceed customer requirements. With a firm belief in the sustainable advancement of technology, Sivers aims to redefine the telecom landscape through ambitious projects like this one, underlining their key role as critical enablers of a greener data economy.

In summary, this $5.4 million chip development program plays a crucial role in shaping the future of telecom infrastructure, enhancing Sivers Semiconductors' portfolio in the millimeter-wave sector, and solidifying its longstanding partnerships with industry leaders. As the demand for high-performance telecom solutions continues to rise, Sivers is poised to lead the way with cutting-edge technology and innovative approaches to meet evolving market needs. For more information about Sivers Semiconductors and its key offerings, visit Sivers Semiconductors.