#China #Shanghai #Integrated Circuit #JCET Group #Q1 2026

JCET Reports Noteworthy Financial Growth in Q1 2026

On April 28, 2026, JCET Group (SSE: 600584), a front-runner in integrated circuit (IC) back-end manufacturing and technology services, unveiled its financial achievements for the first quarter of the year. The report highlights a significant revenue of RMB 9.17 billion, along with a net profit attributable to shareholders of RMB 290 million. This marks a notable year-over-year growth rate of 42.7%.

This financial surge can be attributed to various strategic initiatives undertaken by JCET throughout the past year. The company has made significant strides in commercializing their research and development (R&D) efforts, bolstering their advanced manufacturing capabilities, and steadily growing their global customer base. As a result, JCET has experienced a comprehensive improvement in both the scale of its business operations and overall profitability.

Growth by Application Segment

In terms of specific applications, the computing electronics sector has sustained its impressive growth momentum from 2025, demonstrating a 14.2% increase in revenue year-over-year during the reported period. JCET Microelectronics (Jiangyin) Co., Ltd., known for serving high-value sectors such as high-performance computing (HPC) chips, has achieved stable production volumes and is actively expanding its advanced packaging and testing capabilities to cater to the surging demand from customers.

The automotive electronics sector has also witnessed robust growth, with revenue soaring by 28.8% compared to the previous year. Following the official production launch at JCET Shanghai Automotive Co., Ltd., the organization is fast-tracking product introductions and mass production aimed at cutting-edge applications like autonomous driving, intelligent robotics, and power management systems. This expansion reinforces JCET's capacity and delivery ecosystem in high-end markets. Additionally, other domestic facilities of JCET are operating at high capacity utilization levels, with expansion plans proceeding smoothly.

JCET's international facilities located in South Korea and Singapore have reported the successful introduction of new products geared toward multiple leading international customers. This effort has helped accelerate the optimization of the business structure, laying a solid foundation for substantial growth throughout the year.

Reinforcing R&D and Engineering

Simultaneously, JCET is enhancing its R&D infrastructure and engineering prowess across core technology domains. The first quarter of 2026 marked the official opening of the JCET Zhangjiang R&D building in Shanghai. Fitted with cutting-edge facilities, including a specialized chip performance laboratory, this new center is set to provide robust support for technological innovations, product validation processes, and the nurturing of elite engineering talent.

CEO of JCET Group, Mr. Li Zheng, stated, "In line with global market needs, JCET is advancing robustly into wafer-level and system-level advanced packaging, along with supplementary high-end testing. This strategic direction injects significant momentum into the IC backend manufacturing landscape. At this critical juncture—where advanced packaging solidifies the connection between prevailing and next-generation technologies, and mainstream packaging transitions rapidly toward advanced formats—JCET remains unwavering in its commitment to substantial investments in high-end manufacturing capabilities and cutting-edge process R&D. We pledge to deliver a highly reliable and innovative platform for manufacturing and technical services to our extensive range of premium customers across diverse global markets."

For further details, refer to the full JCET Q1 2026 report, which outlines the company's strategies and financial outcomes in depth.

About JCET Group

JCET Group is a globally prominent leader in integrated circuit back-end manufacturing and technology services. They offer a comprehensive suite of turnkey solutions, encompassing semiconductor package integration design, wafer probing, bumping, assembly, final testing, and worldwide drop shipments. By leveraging advanced wafer-level packaging techniques, 2.5D/3D packaging, and reliable flip chip and wire bonding technologies, JCET supports a broad array of applications spanning automotive, artificial intelligence, high-performance computing, communications, smart devices, industrial, medical sectors, and power management. With eight manufacturing facilities distributed across China, Korea, and Singapore, JCET excels in providing efficient supply chain solutions while maintaining close collaborative relationships with global customers.