#China #Yantai #Raytron #OHLE 3123 #Thermal Sensor

Raytron Microelectronics Unveils the OHLE 3123

In a significant advancement for thermal imaging technology, Raytron Microelectronics has introduced the OHLE 3123, the world’s first uncooled LWIR thermal sensor utilizing the innovative Super Wafer-Level Packaging (SWLP) technology. This groundbreaking development not only enhances the capabilities of thermal sensors but also dramatically lowers production costs, opening new doors for various applications ranging from automotive night-vision systems to industrial temperature monitoring.

The Evolution of Thermal Imaging Technology

Thermal imaging, once a niche technology reserved for specialized applications, has seen a considerable reduction in costs due to advancements in infrared imaging technology. Products previously deemed too expensive have now made their way to consumer markets, making thermal imaging accessible to a broader audience. However, the core components necessary for thermal imaging have traditionally been produced by a limited number of manufacturers due to high fabrication costs and specific production requirements.

This limitation has now been addressed by Raytron with the release of the OHLE 3123 sensor, designed for increased integration and cost competitiveness in the market.

What Makes SWLP Technology a Game Changer?

The SWLP technology utilized in the OHLE 3123 is a revolutionary two-layer packaging system that eliminates the need for cleanroom environments in manufacturing, a requirement that has historically driven up costs. By being compatible with surface-mount technology (SMT), the OHLE 3123 enables rapid mass production, significantly reducing production expenses. This application is crucial for the cost-effective supply of infrared sensors in today’s competitive landscape.

The innovative design of the uncooled infrared focal plane array (IFPA) includes a vanadium oxide (VOx) microbolometer array, providing a resolution of 384 × 288 pixels with a pixel pitch of 12 µm and a noise equivalent temperature difference (NETD) of less than 40 mK. Notably, it operates with a remarkably low power consumption of under 65 mW.

Enhancing Production Capabilities for Businesses

With these specifications, the OHLE 3123 sensor empowers more businesses to develop and manufacture thermal imaging modules independently. Its ultracompact and lightweight design, coupled with high-quality imaging capabilities, make it ideally suited for a range of applications including outdoor night-vision cameras, industrial temperature monitoring, security surveillance, and automotive night-vision systems.

The unique window design also allows the sensor to overcome atmospheric and environmental integration challenges, making it a robust solution for various operational conditions.

Launch at the LASER World of PHOTONICS 2025

Raytron Microelectronics plans to showcase the OHLE 3123 thermal sensor at the LASER World of PHOTONICS 2025, taking place in Munich from June 24 to 27. Interested parties can request samples at Hall A2, Booth No. 372 to experience firsthand this revolutionary innovation in thermal core technology.

Raytron is committed to creating value through technological advancements and possesses extensive expertise in infrared technology, microwaves, and laser applications. The company is poised to deliver exceptional OEM thermal camera core modules and infrared sensors to customers worldwide, thereby enhancing the capabilities of various industries.

For OEM partnerships or bulk inquiries, please contact email protected] or visit [Raytron's website.

In conclusion, the introduction of the OHLE 3123 by Raytron Microelectronics marks a pivotal moment in the thermal imaging industry, paving the way for enhanced accessibility and innovation in various applications. As the demand for thermal imaging solutions continues to grow, technologies like SWLP offer exciting possibilities for future developments.