#United States #US Conec #SANWA Technologies #VSFF Connectors #Hickory,North Carolina

US Conec and SANWA Technologies Collaborate on VSFF Connector Solutions

In an exciting development that promises to enhance optical connectivity, US Conec and SANWA Technologies have officially entered into a licensing agreement that enables SANWA to produce and supply various Very Small Form Factor (VSFF) connector solutions. This collaboration includes MDC duplex optical connectors and MMC multi-fiber adapters, aiming to meet the increasing demands of the optical communication market.

The Need for High-Density Connectivity

As technology advances, the demand for high-density fiber optic solutions has surged, particularly in next-generation optical link architectures that support up to 800G and beyond. Existing solutions, such as MPO and LC technologies, often fall short in meeting the performance and density requirements necessary for modern data centers and telecommunications networks. This is where the new MDC and MMC connector formats from US Conec come into play. They cater to both carrier-grade and data center environments, ensuring compatibility with cutting-edge pluggable transceivers and embedded optic solutions.

Voices from Leadership

Aki Ishikawa, the COO and CSO of SANWA Technologies, expressed enthusiasm about this new partnership: "We are very excited to partner with US Conec on this licensing agreement, enabling us to commercialize our MDC and MMC connectivity solutions. In collaboration with US Conec and their expertise in VSFF technologies, SANWA is fully committed to enhancing both platforms to meet rapidly growing market demands."

Mike Hughes, VP of Product Management at US Conec, echoed these sentiments, stating, "It's exciting to have SANWA Technologies on board as a partner for the MMC and MDC connector platforms. Their history of connector technology development and superior customer support will help ensure that market needs related to the proliferation of the VSFF solutions are soundly met."

Upcoming Showcases

To showcase their joint efforts, US Conec and SANWA Technologies will present their innovative MDC and MMC solutions at the OFC 2025 conference in San Francisco, which runs from April 1 to April 3, 2025. Attendees can visit US Conec at Booth #1443 and SANWA at Booth #3126 to explore the features and benefits of these new connector solutions.

About US Conec

Based in Hickory, North Carolina, US Conec is recognized globally for its design and development of high-density optical interconnects. With a rich history of over 30 years, the company provides top-tier components for various markets, including data centers, enterprise structured cabling, and military applications. US Conec is an equity venture involving three leading communications technology firms: Corning Optical Communications, Fujikura, and NTT-AT.

For more detailed information about their offerings, visit www.usconec.com.

About SANWA Technologies

Headquartered in Tokyo, Japan, SANWA Technologies has built a solid reputation over its 75 years in the optical communications sector. They focus on developing quality connectivity solutions that enhance the performance of modern optical networks. With significant production capabilities in Thailand and global sales operations in various locations, including the US and Europe, SANWA aims to continue playing a pivotal role in the industry's evolution.

To learn more, check out their website at www.SANWA-tech.com.