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Innovative Integrated Storage Solutions Unveiled by Longsys at MWC 2026

Longsys, a leader in semiconductor memory solutions, has taken a significant step towards enhancing on-device artificial intelligence by showcasing its latest integrated storage solutions at the Mobile World Congress (MWC) 2026 in Barcelona. Under the theme of 'AI Storage for the Mobile World,' the company presented next-generation products designed for smartphones, wearables, and personal computers, focusing on the growing demand for high-capacity, high-performance memory solutions.

Addressing the Challenges of Increasing AI Device Capabilities

As the demand for AI-enabled devices skyrockets, memory technology must evolve to meet rising expectations for capacity, performance, power efficiency, and comprehensive co-optimization of software and hardware. This evolution includes system-level integration, which is at the core of Longsys's new offerings. By combining expertise in controller design, firmware algorithms, advanced packaging, and manufacturing, Longsys has transitioned from a standard memory provider to a branded semiconductor manufacturer, delivering value-driven, integrated solutions.

AI Mobile Device Storage Solutions

In response to the ongoing challenges in DRAM supply, Longsys introduced its proprietary High-Level Cache (HLC) technology, which is integrated within Universal Flash Storage (UFS) products. With the ability to handle warm and cold data traditionally stored in DRAM, this technology effectively reduces the need for terminal DRAM while optimizing the bill of materials (BOM) costs for AI smartphones, tablets, and embedded robots, ensuring a seamless user experience. Additionally, the incorporation of pTLC technology into the UFS line allows for intelligent firmware-switching between QLC, TLC, and SLC, offering TLC-level data retention with significant cost advantages, thus striking a balance between capacity, performance, and endurance for demanding AI applications.

Ultra-Compact Storage for AI Wearables

With the surge in AI glasses and smartwatches, Longsys unveiled its latest storage solutions, including ePOP5x, ePOP4x, and Subsize eMMC. The flagship ePOP5x features the same footprint as its predecessor but is 35% thinner at just 0.52 mm. It doubles DRAM speed to 8533 Mbps while offering flexible capacity configurations, making it essential for the next generation of smart glasses due to its ultra-compact size and low power consumption.

High-Performance Storage for AI PCs

To tackle the challenges of real-time data throughput in AI PCs, Longsys highlighted its mSSD storage medium, characterized by high bandwidth and low latency. This technology has spawned the industry’s first AI Storage Core architecture under its premium brand, Lexar. This innovation supports flexible, high-capacity, and hot-swappable storage solutions used in new products, including the AI-Grade Storage Stick for AI notebooks and AI-Grade SSDs optimized for powerful AI tasks.

Building a Complete AI Storage Ecosystem

With end-to-end capabilities that encompass controller design, media frontend, firmware, and manufacturing processes, Longsys is constructing a comprehensive AI storage ecosystem aimed at providing competitive integrated solutions that meet the diverse requirements of the on-device AI era.

About Longsys

Founded in 1999, Longsys (301308.SZ) is a premier global brand in semiconductor memory, integrating research and development, design, packaging and testing, manufacturing, and distribution services. The company upholds the vision 'Everything for Storage,' with memory technology innovation at its core, offering high-end, flexible, and efficient full-stack services to clients worldwide. For more details, visit Longsys Website. Stay connected with Longsys on LinkedIn, Facebook, and Twitter.