LITEON Showcases Revolutionary AI and HPC Solutions at Super Computing 2025
LITEON Technology, a leader in high-performance computing solutions, made a significant impression at this year's Super Computing 2025 (SC25) event held in St. Louis, USA from November 16 to 21. With the rapid advancements in artificial intelligence (AI) and computing power, LITEON presented its latest offerings that integrate seamlessly with NVIDIA technologies, aimed at meeting the growing demand for AI-driven processing.
Enhancing AI Infrastructure with NVIDIA Integration
Focusing on the next-generation AI factory standards, LITEON introduced an array of integrated solutions built on the NVIDIA MGX architecture. The innovative suite includes cutting-edge power, rack, and liquid cooling systems designed to optimize performance in high-density computing environments. The range features a powerful
800 VDC Power Rack,
BBU,
Capacitor Shelf, and advanced cooling solutions like the
2.1MW in-Row CDU and
140kW Liquid to Air Sidecar. These technologies are set to enable clients to deploy efficient and scalable AI infrastructures quickly and effectively.
Key Features of LITEON's Innovations
LITEON's power solutions are engineered to support various generations of NVIDIA AI infrastructure. Notably, the 800 VDC power solution is capable of delivering up to
1.2MW output and includes high-capacity capacitors that efficiently manage input currents, particularly under heavy GPU loads. Coupled with intelligent software capabilities, it enables remote monitoring and control while also facilitating firmware updates to boost operational efficiency.
The design enhancements provide unparalleled advantages over traditional architectures, particularly in high power density and energy storage efficiency. Safety mechanisms, including touch-proof designs and emergency shutdown protocols, further ensure reliability in high-performance computing environments, catering specifically to AI server demands.
A Robust Solution for Data Centers
Each of LITEON's high-voltage racks and liquid cooling systems is designed for ultra-high-density AI computing. With power capacities ranging between
600kW to 1.2MW, these robust systems boast a structural strength of over
3,500 kg and can support multi-zone GPU configurations without compromising efficiency or maintenance ease. The hybrid design blends high efficiency and low loss, presenting scalable infrastructure solutions that are poised for the future of AI data centers.
In terms of liquid cooling, LITEON’s
2.1MW in-row CDU is equipped for versatility with a wide voltage input and features an advanced 25-micron filter along with a redundancy design that supports real-time monitoring of coolant quality. Such components ensure stable system operation in demanding conditions, reinforcing LITEON’s commitment to reliability.
Continuous Growth in the AI Market
Having now participated in Super Computing for four consecutive years, LITEON Technology continues to solidify its presence in the competitive AI data center market. This year’s showcase attracted attention not only for its innovative product offerings but also for the robust demand seen in high-power systems and thermal management technologies. As the market for AI GPUs expands, LITEON is witnessing steady growth in product shipments across various components, aligning with the increasing need for advanced cooling and power solutions.
Final Thoughts
LITEON’s commitment to revolutionizing AI and HPC infrastructures was clearly evident at SC25. The company’s comprehensive product range, including updated power systems, thermal management technologies, and design frameworks, positions it strongly for future advancements. With its innovative approach and extensive solutions geared towards next-generation AI capabilities, LITEON is set to contribute significantly to the evolution of data centers worldwide. For those interested in learning more about their offerings, further details can be found on
LITEON’s official website.