Tongxin Micro's Cutting-Edge Security Solutions Shine at Seamless Middle East Fintech 2025
Tongxin Microelectronics, commonly referred to as Tongxin Micro, has made a notable impact at the Seamless Middle East Fintech 2025 event held from May 20 to 22 at the Dubai World Trade Centre. As a leading provider of chips and solutions within the electronic payment ecosystem, the company showcased its advanced security chip technologies, which have garnered significant attention from stakeholders involved in the global payments landscape.
Highlighting their commitment to innovation and security, Tongxin Micro's security chips are equipped for use in payment IC cards and payment terminals, demonstrating compliance with prominent international standards. This includes certifications such as EMVCo and CC EAL6+. The adoption of these chips extends across several major global payment platforms, including UnionPay, VISA, MasterCard, American Express, JCB, and Discover. As a testament to their effectiveness, these advanced chips have been deployed in more than 100 countries and regions worldwide.
Furthermore, the company’s security chips designed specifically for payment terminals comply with rigorous standards, including PCI 7.x and UPTS 3.0. These chips are renowned for their efficiency in processing, ultra-low power consumption, and extensive compatibility with various ecosystems. Their applications span a range of smart POS and mPOS systems, biometric USB for FIDO authentication, and other secure payment hardware, marking their presence in international financial markets.
A standout feature of the presentation was the introduction of their MIS integrated terminal platform. Powered by Tongxin Micro's secure MCU, this all-in-one payment solution incorporates NFC and QR code scanning capabilities, facilitating seamless transactions across major brands such as VISA and MasterCard. This innovation addresses market demands for a compact yet multifunctional POS device, ensuring that payment solutions remain ahead of evolving consumer needs.
In addition to the MIS terminal platform, Tongxin Micro revealed the industry's first eSIM solution tailored explicit for smart POS devices. This state-of-the-art solution integrates chip-on-board technology, allowing for eSIM activation and wafer-level personalization. With the introduction of this innovative technology, Tongxin Micro eliminates the necessity for physical SIM cards, thereby enhancing connectivity capabilities globally for mobile plug-and-play payment terminals.
With over 24 years of dedicated research and development in secure chip technology, Tongxin Micro has successfully shipped more than 25 billion chips across various continents, including Asia, Europe, the Americas, and Africa. The company's deep-rooted experience is complemented by its commitment to collaborating with industry partners to forge a secure and technological future in payment solutions. Through such initiatives, Tongxin Micro aims to continue shaping the landscape of electronic payments, making significant contributions to the financial services industry.
In conclusion, Tongxin Micro's participation in the Seamless Middle East Fintech 2025 not only underscores their technological prowess but also reaffirms their dedication to enhancing the security infrastructure upon which global payments rely. With continued innovation and strategic partnerships, the future looks promising for security in the world of fintech.
For further information and updates about Tongxin Micro, visit their official website at www.tsinghuaic.com.
Highlighting their commitment to innovation and security, Tongxin Micro's security chips are equipped for use in payment IC cards and payment terminals, demonstrating compliance with prominent international standards. This includes certifications such as EMVCo and CC EAL6+. The adoption of these chips extends across several major global payment platforms, including UnionPay, VISA, MasterCard, American Express, JCB, and Discover. As a testament to their effectiveness, these advanced chips have been deployed in more than 100 countries and regions worldwide.
Furthermore, the company’s security chips designed specifically for payment terminals comply with rigorous standards, including PCI 7.x and UPTS 3.0. These chips are renowned for their efficiency in processing, ultra-low power consumption, and extensive compatibility with various ecosystems. Their applications span a range of smart POS and mPOS systems, biometric USB for FIDO authentication, and other secure payment hardware, marking their presence in international financial markets.
A standout feature of the presentation was the introduction of their MIS integrated terminal platform. Powered by Tongxin Micro's secure MCU, this all-in-one payment solution incorporates NFC and QR code scanning capabilities, facilitating seamless transactions across major brands such as VISA and MasterCard. This innovation addresses market demands for a compact yet multifunctional POS device, ensuring that payment solutions remain ahead of evolving consumer needs.
In addition to the MIS terminal platform, Tongxin Micro revealed the industry's first eSIM solution tailored explicit for smart POS devices. This state-of-the-art solution integrates chip-on-board technology, allowing for eSIM activation and wafer-level personalization. With the introduction of this innovative technology, Tongxin Micro eliminates the necessity for physical SIM cards, thereby enhancing connectivity capabilities globally for mobile plug-and-play payment terminals.
With over 24 years of dedicated research and development in secure chip technology, Tongxin Micro has successfully shipped more than 25 billion chips across various continents, including Asia, Europe, the Americas, and Africa. The company's deep-rooted experience is complemented by its commitment to collaborating with industry partners to forge a secure and technological future in payment solutions. Through such initiatives, Tongxin Micro aims to continue shaping the landscape of electronic payments, making significant contributions to the financial services industry.
In conclusion, Tongxin Micro's participation in the Seamless Middle East Fintech 2025 not only underscores their technological prowess but also reaffirms their dedication to enhancing the security infrastructure upon which global payments rely. With continued innovation and strategic partnerships, the future looks promising for security in the world of fintech.
For further information and updates about Tongxin Micro, visit their official website at www.tsinghuaic.com.
Topics Consumer Technology）
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