Revitalizing Japan's Semiconductor Industry: Insights from the AI Agent × AX Forum

On January 22, AI Data Corporation organized the AI Agent × AX Forum focused on enhancing Japan's competitiveness in the AI semiconductor sector, a critical area for the country's strategic initiatives. This event drew attention amidst escalating international competition in the semiconductor and AI domains, bringing forth innovative developmental and managerial models supported by advanced AI technology.

Session Highlights

The forum showcased significant discussions over four sessions, blending insights from industry leaders and researchers:

Session 1: National Competitiveness in the Semiconductor AI Era

Daisuke Sasaki, CEO of AOS Group, presented strategies for Japan to regain its competitive edge against international players. He introduced the concepts of “AI PMO” and “MOAT OS,” emphasizing the need for an integrated command function that governs AI application at both national and corporate levels. Sasaki stressed the importance of managing data, semiconductors, and AI as a unified entity, asserting that establishing a “MOAT”—a protective and value-building strategy—would be crucial for the industry's revitalization.

Session 2: Transforming Semiconductor Development with AI

Daisuke Shida, CTO of AI Data Corporation, highlighted the potential of AI agents within the “AI ChipInfra on IDX” framework. His demonstrations illustrated how a group of seven AI agents enhances decision-making and knowledge utilization throughout the increasingly complex semiconductor development process. By effectively utilizing proprietary knowledge and data, Shida proposed that this AI-driven methodology could significantly shorten development timelines while improving product quality, thereby bolstering Japan's semiconductor industry's global standing.

Session 3: Advances in Oxide Semiconductor Technology for 3D LSI

Professor Koji Uraoka from Nara Institute of Science and Technology delivered insights on the latest advancements in oxide semiconductor technology crucial for 3D LSI performance enhancement. As industry challenges related to miniaturization arise, Uraoka identified the potential of 3D integration as a solution, highlighting oxide semiconductors' properties—such as high electron mobility and low-temperature processing—as pivotal for next-generation devices and AI applications. He also discussed the ongoing research and development efforts that bridge the gap between foundational studies and practical applications in the industry.

Session 4: Advancements in Interconnection Resin Technology for AI Semiconductors

Kenji Fujiwara, a senior researcher at Toray, discussed the innovative interconnection resin technology essential for high-performance AI semiconductor packaging. His talk covered various elements, such as polymer hybrid bonding and re-routing techniques, which contribute to improving implementation density and reliability. He emphasized the evolving material technologies that are necessary to meet increasing heat resistance and electrical performance demands, alongside the technical challenges that lie ahead for realizing cutting-edge packaging solutions.

Special Session: Data and Intellectual Property in the Semiconductor Sector

In a closing special session, Sasaki and Shida, along with Professors Uraoka and Fujiwara, engaged in a profound discussion regarding the significance of data and intellectual property (IP) within the semiconductor industry. They underscored the notion that, in the AI era, not merely technological innovations but also the systematic management and strategic utilization of accumulated data and IP are crucial for competitiveness. The dialogue concluded with acknowledgment of the need to connect semiconductor technology, data, and IP comprehensively to foster sustainable growth in the industry.